Effects of scaling and grain structure on electromigration reliability of Cu interconnects
Electromigration (EM) remains a major reliability concern for on-chip Cu interconnects due to the continuing scaling and the introduction of new materials and processes. In Cu interconnects, the atomic diffusion along the Cu/SiCN cap interface dominates the mass transport and thus controls EM reliab...
Main Author: | Zhang, Lijuan, 1979- |
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Format: | Others |
Language: | English |
Published: |
2011
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Subjects: | |
Online Access: | http://hdl.handle.net/2152/ETD-UT-2010-12-2136 |
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