Materials research on metallized aluminum-nitride for microelectronic packaging
The use of aluminum nitride as a substrate material for microelectronics is examined. A brief look at thermal, mechanical, and electrical properties of aluminum nitride show that it is a viable alternative material for this use. A study of the interfaces between aluminum nitride and several thick fi...
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| Language: | en_US |
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The University of Arizona.
1988
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| Online Access: | http://hdl.handle.net/10150/276913 |