An in situ Surface Stress Study of Electrochemical Phenomena: Electrodeposition and Molecular Adsorption
abstract: Over the last decade copper electrodeposition has become the dominant process by which microelectronic interconnects are made. Replacing ultra-high vacuum evaporative film growth, the technology known as the Cu damascene process has been widely implemented in the microelectronics industry...
| Other Authors: | |
|---|---|
| Format: | Doctoral Thesis |
| Language: | English |
| Published: |
2011
|
| Subjects: | |
| Online Access: | http://hdl.handle.net/2286/R.I.14358 |