Phase-Field Modeling of Electromigration-Mediated Morphological Evolution of Voids in Interconnects
abstract: Miniaturization of microdevices comes at the cost of increased circuit complexity and operating current densities. At high current densities, the resulting electron wind imparts a large momentum to metal ions triggering electromigration which leads to degradation of interconnects and solde...
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| Format: | Dissertation |
| Language: | English |
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2020
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| Online Access: | http://hdl.handle.net/2286/R.I.57105 |