Mechanical behaviour and reliability of Sn3.8AgO.7Cu solder for a surface mount assembly
The demands for compact, light weight and Iow cost electronic products have resulted in the miniaturisation of solder interconnects to a sub-millimetre scale. With such a reduction in size, the solder joints cannot be assumed to behave in the same way as bulk solder in terms of reliability due to th...
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Loughborough University
2008
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| Online Access: | http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.510296 |