Accuracy, Precision, and Resolution in Strain Measurements on Diffraction Instruments
Diffraction stress analysis is a commonly used technique to evaluate the properties and performance of different classes of materials from engineering materials, such as steels and alloys, to electronic materials like Silicon chips. Often to better understand the performance of these materials at o...
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| Language: | English |
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2011
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| Online Access: | https://doi.org/10.7916/D8J1094V |