Triboelectrochemical Characterization of Microelectronic Materials
Non-uniformity in chemical-mechanical planarization (CMP) due to diverse pattern geometry in copper damascene structures has been a critical limit to process yield. Fundamental understanding in tribology and electrochemistry is crucial to solve this problem. This research develops novel triboelectro...
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| Format: | Others |
| Language: | en |
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2013
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| Online Access: | http://hdl.handle.net/1969.1/149288 |