Surface Chemical Deposition of Advanced Electronic Materials
The focus of this work was to examine the direct plating of Cu on Ru diffusion barriers for use in interconnect technology and the substrate mediated growth of graphene on boron nitride for use in advanced electronic applications. The electrodeposition of Cu on Ru(0001) and polycrystalline substrate...
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| Format: | Others |
| Language: | English |
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University of North Texas
2010
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| Online Access: | https://digital.library.unt.edu/ark:/67531/metadc67938/ |