Modeling of modulus graded axisymmetric adhesive joints
This study presents a refined theoretical framework for the stress analysis of modulus graded axisymmetric adhesive joints which takes into account the radial stresses in the bonded assembly. This semi-analytical is based on a variational method which minimizes the complementary energy of the bonded...
| Main Authors: | , |
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| Format: | Article |
| Language: | English |
| Published: |
2011-02-21.
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| Subjects: | |
| Online Access: | Get fulltext |