Showing 1 - 4 results of 4 for search 'ADVANCED ANALYTICAL INVESTIGATION', query time: 0.72s Refine Results
  1. 1
    Analysis and Investigation of Strain Engineering on Advanced Nanoscale Devices Using the Column IV Semiconductor Alloys
    by Sen-wen Cheng, 鄭森文
    Published 2015
    “... channel. In the meanwhile, investigating the channel stress differences by using different concentrations...”
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  2. 2
    Stress Impact of the Annealing Procedure of Cu-Filled TSV Packaging on the Performance of Nano-Scaled MOSFETs Evaluated by an Analytical Solution and FEA-Based Submodeling Technique
    by Pei-Chen Huang, Chang-Chun Lee
    Published 2021-09-01
    “... analytical solution for TSV stress-affected zone estimation, Lamé radial stress solution, is investigated...”
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    Article
  3. 3
    Investigation of Micro Electronic Devices Reliability Using Interfacial Crack Growth Prediction Methodology
    by Chang-Chun Lee, 李昌駿
    Published 2006
    “... in advanced packaging structures. Therefore, this fracturing problem has become one of the critical issues...”
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  4. 4
    Analysis and Investigation of Material Equivalent Mechanics-Based Simulated Approach on Three-Dimensional Chip Stacking Structure
    by Bow-Tsin Chian, 錢保岑
    Published 2015
    “... technologies, the framework developments of electronic packaging has great advancements including...”
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