“...碩士 === 國立清華大學 === 動力機械工程學系 === 95 === In recent years, there has been much advancement in the field...”
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“... in many advanced applications. For the purpose of operating the piezoresistive pressure sensor in harsh...”
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“... in advanced packaging structures. Therefore, this fracturing problem has become one of the critical issues...”
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“... attachment of advanced electronic packages. A solder ball with low shear strength is usually considered a...”
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