Showing 1 - 9 results of 9 for search 'DIGITAL ELECTRONIC FUNDAMENTALS', query time: 0.63s Refine Results
  1. 1
    Fundamental Consumables Characterization of Advanced Dielectric and Metal Chemical Mechanical Planarization Processes
    by Sampurno, Yasa
    Published 2008
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  2. 2
    Fundamental Characterization of Chemical Mechanical Planarization Relating to Slurry Dispensing and Conditioning Method
    by Han, Ruochen, Han, Ruochen
    Published 2017
    “.... To fundamentally elucidate the cause(s) of such differences, pad surface contact area and topography are analyzed...”
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  3. 3
    Process Optimization and Fundamental Consumables Characterization of Advanced Dielectric and Metal Chemical Mechanical Planarization
    by Liao, Xiaoyan
    Published 2014
    “... using laser confocal microscopy and scanning electron microscopy (SEM) to illustrate how variations...”
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  4. 4
    FUNDAMENTAL CHARACTERIZATION OF TRIBOLOGICAL, THERMAL, FLUID DYNAMIC AND WEAR ATTRIBUTES OF CONSUMABLES IN CHEMICAL MECHANICAL PLANARIZATION
    by Wei, Xiaomin
    Published 2010
    “...This dissertation presents several studies relating to fundamental characterization of CMP...”
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  5. 5
    Slurry Mean Residence Time Analysis and Pad-Wafer Contact Characterization in Chemical Mechanical Planarization
    by Mu, Yan, Mu, Yan
    Published 2016
    “... of these studies is to further understand the fundamentals of CMP and to explore solutions to some of CMP...”
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    Get full text
  6. 6
    Control Of Slurry Flow, Temperature And Aggressive Diamonds In Chemical Mechanical Planarization
    by Wu, Changhong
    Published 2015
    “... of these studies is to better understand the fundamentals of CMP and to explore solutions to some of CMP’s greatest...”
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  7. 7
    Wear and Contact Phenomena in Existing and Future Large-Scale Chemical Mechanical Planarization Processes
    by Jiao, Yubo
    Published 2012
    “... study to provide fundamental understanding of Ti removal mechanism. The last contribution...”
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  8. 8
    Evaluation and Modeling of Alternative Copper and Inter-Layer Dielectric Chemical Mechanical Planarization Technologies
    by DeNardis, Darren
    Published 2006
    “...) trends as conventional abrasive slurry CMP, while possibly decreasing wafer defects. Fundamental...”
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  9. 9
    Characterization and Modeling of Mainstream and Alternative Conditioning and Polishing Technologies in Inter-Layer Dielectric and Copper Chemical Mechanical Planarization
    by Lee, Hyosang
    Published 2008
    “...This dissertation consists of four topics that focused on investigating the fundamental...”
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