Showing 1 - 20 results of 21 for search 'ELECTRONIC AND SEMICONDUCTOR MATERIALS', query time: 0.68s Refine Results
  1. 1
    Flexible Electronics: Materials and Device Fabrication
    by Sankir, Nurdan Demirci
    Published 2014
    Subjects: “...flexible electronics...”
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  2. 2
    Structure Characterization and Electronic Properties Investigation of Two-Dimensional Materials
    by Baniasadi, Fazel
    Published 2021
    Subjects: “...2D Materials...”
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  3. 3
    Effect of Out-Tunneling Leakage and Electron-Hole Asymmetry on Modulation Response of Semiconductor Double Tunneling-Injection Quantum Dot Lasers
    by Kar, Saurav
    Published 2017
    Subjects: “...semiconductor lasers...”
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  4. 4
    Low-Temperature Sintering of Nanoscale Silver Paste for Semiconductor Device Interconnection
    by Bai, Guofeng
    Published 2014
    Subjects: “...Semiconductor device interconnection...”
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  5. 5
    Polymer-Supported Bridges for Multi-Finger AlGaN/GaN Heterojunction Field Effect Transistors (HFETs)
    by Willemann, Michael Howard
    Published 2014
    Subjects: “...Wide-bandgap semiconductor...”
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  6. 6
    Theoretical Study of Semiconductor Quantum Dot Lasers with Asymmetric Barrier Layers
    by Monk, John Lawrence III
    Published 2020
    Subjects: “...Semiconductor...”
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  7. 7
    Electro-optic Properties of Semiconductor Nano-crystals And Electro-optic Polymers And Their Applications
    by Zhang, Fajian
    Published 2014
    Subjects: “...Semiconductor nano-clusters...”
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  8. 8
    Theory of Tunneling-Injection Quantum Dot Lasers
    by Han, Dae-Seob
    Published 2014
    Subjects: “...semiconductor lasers...”
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  9. 9
    The Effect of Growth Method on GaN Films and Their Interfaces with CdTe and CdS
    by Gouldey, David
    Published 2017
    Subjects: “...semiconductors...”
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  10. 10
    Thermomechanical Reliability of Low-Temperature Sintered Attachments on Direct Bonded Aluminum (DBA) Substrate for High-Temperature Electronics Packaging
    by Lei, Guangyin
    Published 2014
    Subjects: “...high-temperature electronics...”
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  11. 11
    Low Impurity Content GaN Prepared via OMVPE for Use in Power Electronic Devices: Connection Between Growth Rate, Ammonia Flow, and Impurity Incorporation
    by Ciarkowski, Timothy A.
    Published 2019
    Subjects: “...High Power Electronics...”
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  12. 12
    Template Directed Growth of Nb doped SrTiO3 using Pulsed Laser Deposition
    by Waller, Gordon Henry
    Published 2014
    Subjects: “...Electron Beam Lithography...”
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  13. 13
    Processing and Reliability Assessment of Solder Joint Interconnection for Power Chips
    by Liu, Xingsheng
    Published 2014
    Subjects: “...Power Electronics Packaging...”
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  14. 14
    Thermal Stability of Al₂O₃/Silicone Composites as High-Temperature Encapsulants
    by Yao, Yiying
    Published 2014
    Subjects: “...power electronic packaging...”
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  15. 15
    Microstructural Evolution in Thermally Cycled Large-Area Lead and Lead-Free Solder Joints
    by Stinson-Bagby, Kelly Lucile
    Published 2014
    “...Currently, there are two major driving forces for considering alternative materials to lead- based...”
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  16. 16
    Synthesis and Characterization of Si, Ge, and SixGe1-x Nanowires by Fiber Drawing
    by Floyd, Adam R.
    Published 2019
    “... and germanium, which are two of the most important materials currently used in electronics. These semiconductors...”
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  17. 17
    Ferroelectric Thin Films for High Density Non-volatile Memories
    by Song, Yoon-Jong
    Published 2014
    “... zirconate titanate (PZT) is recently considered as one of the most promising materials for DRO FRAM devices...”
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  18. 18
    A diffusion-viscous analysis and experimental verification of the drying behavior in nanosilver-enabled low-temperature joining technique
    by Xiao, Kewei
    Published 2014
    “... manufacturers of power electronics devices and modules for bonding power semiconductor chips. A common die...”
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  19. 19
    Design, Analysis and Experimental Verification of a Mechanically Compliant Interface for Fabricating Reliable, Double-Side Cooled, High Temperature, Sintered Silver Interconnected Power Modules
    by Berry, David W.
    Published 2016
    “...This research developed a double-side power electronics packaging scheme for high temperature...”
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  20. 20
    Increased Functionality Porous Optical Fiber Structures
    by Wooddell, Michael Gary
    Published 2014
    “..., by integrating electronic device components such as conductors, and semiconductors, and optically active...”
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