Showing 1 - 3 results of 3 for search 'FUNDAMENTAL OF METAL FORMING', query time: 0.88s Refine Results
  1. 1
    Adhesion/Diffusion Barrier Layers for Copper Integration: Carbon-Silicon Polymer Films and Tantalum Substrates
    by Chen, Li
    Published 1999
    Subjects: “...Metallic films....”
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  2. 2
    Atomic Layer Deposition of H-BN(0001) on Transition Metal Substrates, and In Situ XPS Study of Carbonate Removal from Lithium Garnet Surfaces
    by Jones, Jessica C.
    Published 2020
    “... substrate was a monolayer of RuO2(110) formed on a Ru(0001) substrate, the other was an atomically clean Ni...”
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  3. 3
    Study of Interactions Between Diffusion Barrier Layers and Low-k Dielectric Materials for Copper/Low-k Integration
    by Tong, Jinhong
    Published 2003
    “... significant amounts of carbon. Therefore barrier metal diffusion into the dielectric and the formation...”
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