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Search Results - Georgia Institute of Technology
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Georgia Institute of Technology
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1
Modeling, design and demonstration of through-package-vias in panel-based polycrystalline silicon interposers for high performance, high reliability and low cost
by
Chen, Qiao
Published 2015
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...
Georgia
Institute
of
Technology
...
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2
Through-package-via hole formation, metallization and characterization for ultra-thin 3D glass interposer packages
by
Sukumaran, Vijay
Published 2014
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Georgia
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of
Technology
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3
Modeling, design, fabrication and characterization of glass package-to-PCB interconnections
by
Menezes, Gary
Published 2014
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Georgia
Institute
of
Technology
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4
Fine-pitch Cu-snag die-to-die and die-to-interposer interconnections using advanced slid bonding
by
Honrao, Chinmay
Published 2014
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Georgia
Institute
of
Technology
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5
Modeling, design, fabrication and characterization of power delivery networks and resonance suppression in double-sided 3-D glass interposer packages
by
Kumar, Gokul
Published 2016
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Georgia
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of
Technology
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6
Polymer materials, processes, and structures for optical turning in 3D glass photonic interposers
by
Vis, William A.
Published 2016
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Georgia
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of
Technology
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7
Nanoscale electrode and dielectric materials, processes and interfaces to form thin-film tantalum capacitors for high-frequency applications
by
Chakraborti, Parthasarathi
Published 2016
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Georgia
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Tummala, Rao R.
Chakraborti, Parthasarathi
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Chen, Qiao
1
Honrao, Chinmay
1
Kumar, Gokul
1
Menezes, Gary
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Sukumaran, Vijay
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Vis, William A.
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