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1“... components using 3D-IC technologies. Because of THz wavelength between 10μm and 1000μm, the order of optical...”
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2“... fabricated. First of all, through the array design of the cooling holes, the position and size of the Poly-Si...”
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3“... integrated circuits (3D IC). It has high material selectivity and high semiconductor process compatibility...”
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4“... circuit. Hybrid bonding is one of the most important technologies in 3D-ICs because of dielectric polymer...”
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