“...碩士 === 國立成功大學 === 機械工程學系碩博士班 === 93 === 　　The purpose of this thesis is to develop and fabricate a...”
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“... and the advancing in fabrication technology, the minimum feature size is continuously deceasing; this causes...”
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“...) and integrated circuits (IC) structures are usually brittle and their properties characterization is crucial...”
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“... metallic interconnect structures. However, during fabrication, the therm-mechanical mismatch between...”
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