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1“... damage an IC and lower the yield rate. Many parameters will affect the mold adhesion force. However...”
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2“... and fabrication ability progress, tree dimensional integrated circuit (3D IC) becomes the tendency of IC design...”
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3“... designs, which is utilized to fabricate the prototype via CNC machine. Thereafter, the performances...”
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4“... and the power dissipation needs to be less than 500 mW. The designed amplifier is fabricated by AMS 0.8 , double...”
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