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1by Macrelli, Enrico <1984>“...This thesis presents a new approach for the design and fabrication of bond wire magnetics for power...”
Published 2014
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Doctoral Thesis -
2Design, Optimization and Fabrication of Amorphous Silicon Tunable RF MEMS Inductors and Transformersby Chang, Stella“... of the IC. Due to the driving force of CMOS integration and low costs of silicon-based IC fabrication...”
Published 2007
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3Design, Optimization and Fabrication of Amorphous Silicon Tunable RF MEMS Inductors and Transformersby Chang, Stella“... of the IC. Due to the driving force of CMOS integration and low costs of silicon-based IC fabrication...”
Published 2007
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5by Saha, Tanmoy“... budget (≤ 300 ○C), as well as material and chemical compatibility with IC fabrication, allowing...”
Published 2013
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7by Van Staden, Wynand Fourie“... is the fabrication of reproducible Josephson junctions with good IcRn products. One objective of this thesis...”
Published 2008
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8Development of a Multi-User Polyimide-MEMS Fabrication Process and its Application to MicroHotplatesby Lizardo, Ernesto B.Subjects: “...Micro-Fabrication...”
Published 2013
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9by Abu-Rahma, Mohamed Hassan“... of the most challenging obstacles for IC design in nanometer regime. To facilitate variation-tolerant design...”
Published 2008
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10by Abu-Rahma, Mohamed Hassan“... of the most challenging obstacles for IC design in nanometer regime. To facilitate variation-tolerant design...”
Published 2008
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11by Zhang, Hangfang“...Modern ICs need to be designed with proper designer-controllable factors to meet power, speed...”
Published 2018
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13by Mandal, Ayan“...As VLSI fabrication technology scales, an increasing number of processing elements (cores) on a...”
Published 2013
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14by Benakanakere Sheshadri, Vijay“...Advances in fabrication technologies for semiconductor integrated circuits (ICs) have resulted...”
Published 2010
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15by Ruiz Amador, Dolly Natalia“... Breakdown; higher temperatures in IC products generates an increase of the Negative Bias Temperature...”
Published 2012
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16by O'Sullivan, Conor“... of the 3D IC, achieving a device array density of 40.94 m2 per device. The design also has a high spatial...”
Published 2013
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17by O'Sullivan, Conor“... of the 3D IC, achieving a device array density of 40.94 m2 per device. The design also has a high spatial...”
Published 2013
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18by Deng, Henghua“...-on-insulator (SOI) technology is introduced to the design and fabrication of passive polarization rotators (PR...”
Published 2006
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19by Deng, Henghua“...-on-insulator (SOI) technology is introduced to the design and fabrication of passive polarization rotators (PR...”
Published 2006
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20by Ross, Kyle Gene“... (IC) designers are forced to achieve higher and higher bit rates. Increased bit rates in turn impel...”
Published 2006
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