Showing 1 - 20 results of 90 for search 'IC DESIGN AND FABRICATION', query time: 0.76s Refine Results
  1. 1
    by Macrelli, Enrico <1984>
    Published 2014
    ...This thesis presents a new approach for the design and fabrication of bond wire magnetics for power...
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    Doctoral Thesis
  2. 2
    by Chang, Stella
    Published 2007
    ... of the IC. Due to the driving force of CMOS integration and low costs of silicon-based IC fabrication...
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    Others
  3. 3
    by Chang, Stella
    Published 2007
    ... of the IC. Due to the driving force of CMOS integration and low costs of silicon-based IC fabrication...
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    Others
  4. 4
  5. 5
    by Saha, Tanmoy
    Published 2013
    ... budget (≤ 300 ○C), as well as material and chemical compatibility with IC fabrication, allowing...
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  6. 6
  7. 7
    by Van Staden, Wynand Fourie
    Published 2008
    ... is the fabrication of reproducible Josephson junctions with good IcRn products. One objective of this thesis...
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  8. 8
  9. 9
    by Abu-Rahma, Mohamed Hassan
    Published 2008
    ... of the most challenging obstacles for IC design in nanometer regime. To facilitate variation-tolerant design...
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  10. 10
    by Abu-Rahma, Mohamed Hassan
    Published 2008
    ... of the most challenging obstacles for IC design in nanometer regime. To facilitate variation-tolerant design...
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  11. 11
    by Zhang, Hangfang
    Published 2018
    ...Modern ICs need to be designed with proper designer-controllable factors to meet power, speed...
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  12. 12
  13. 13
    by Mandal, Ayan
    Published 2013
    ...As VLSI fabrication technology scales, an increasing number of processing elements (cores) on a...
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  14. 14
    by Benakanakere Sheshadri, Vijay
    Published 2010
    ...Advances in fabrication technologies for semiconductor integrated circuits (ICs) have resulted...
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  15. 15
    by Ruiz Amador, Dolly Natalia
    Published 2012
    ... Breakdown; higher temperatures in IC products generates an increase of the Negative Bias Temperature...
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  16. 16
    by O'Sullivan, Conor
    Published 2013
    ... of the 3D IC, achieving a device array density of 40.94 m2 per device. The design also has a high spatial...
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  17. 17
    by O'Sullivan, Conor
    Published 2013
    ... of the 3D IC, achieving a device array density of 40.94 m2 per device. The design also has a high spatial...
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  18. 18
    by Deng, Henghua
    Published 2006
    ...-on-insulator (SOI) technology is introduced to the design and fabrication of passive polarization rotators (PR...
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  19. 19
    by Deng, Henghua
    Published 2006
    ...-on-insulator (SOI) technology is introduced to the design and fabrication of passive polarization rotators (PR...
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  20. 20
    by Ross, Kyle Gene
    Published 2006
    ... (IC) designers are forced to achieve higher and higher bit rates. Increased bit rates in turn impel...
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