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201by Adhimoulame Kalaisselvane, Natarajan Alagumurthy, Krishnaraj Palaniradja, G Selvaraj Gunasegarane“... the engine exhaust. The geometrical design parameters of the jet compressor were obtained by solving...”
Published 2010-01-01
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202“... data processing. The design is fabricated using a 0.18-μm CMOS process and achieves a 41pA current...”
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204“... circuit, an amplification, a peak-sensing circuit and a counter. The designed circuit is accomplished...”
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207“... size but simultaneously arises the cost on fabrication. The three dimensional integrated circuit (3D IC...”
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209by Akshay Krishna Ramanathan, Srivatsa Srinivasa Rangachar, Hariram Thirucherai Govindarajan, Je-Min Hung, Chun-Ying Lee, Cheng-Xin Xue, Sheng-Po Huang, Fu-Kuo Hsueh, Chang-Hong Shen, Jia-Min Shieh, Wen-Kuan Yeh, Mon-Shu Ho, Jack Sampson, Meng-Fan Chang, Vijaykrishnan NarayananSubjects: “...monolithic (sequential) 3-D integrated circuit (M3D-IC)...”
Published 2021-01-01
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210“... components using 3D-IC technologies. Because of THz wavelength between 10μm and 1000μm, the order of optical...”
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211“... of survival for managing the high technology business. Starting a new high technology fabrication project...”
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212“... drive large current in computer fan ICs for HBM ESD stress. We also design protection circuits...”
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213Published 2017“... (FFT)-based approaches. The BIST IC is designed and fabricated using the 0.18-µm CMOS technology...”
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Doctoral Thesis -
214“... such as stomachaches, diarrhea, headaches, dyspepsia, and anorexia. An integrated circuit (IC) design...”
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216“... input of conventional television sets. The designed RF converter incorporates two pairs of frequency...”
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217“...In this research, a security paper based on frequency selective structure technologies was designed...”
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218“... and strongly. In addition, the IC design and wafer fabrication process development of high-end technology, IC...”
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219“... pursue LCD Driver IC business such as design, wafer fabrication, gold bump, TCP assembly and IC testing...”
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220“... is extremely high. It’s a challenge to the traditional CMP planarization flow of 2D IC design. In this thesis...”
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