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61by Macrelli, Enrico <1984>“...This thesis presents a new approach for the design and fabrication of bond wire magnetics for power...”
Published 2014
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Doctoral Thesis -
62“.... In this thesis, two distributed analog phase shifters implemented using two different IC processes are introduced...”
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63“... micromaching is easier to be integrated and more compatible with integrated circuits(IC). Another advantage...”
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64“... tool fabrication. As yet, no systematic integrated modeling approach for the design of these cutters...”
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65“.... To design well I/O interface cir- cuit can decrease IC device. A UHF programmable Transceiver...”
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66“... in the materials more conveniently using the impedance measurement, the research needs to fabricate the large-sized...”
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67“...-channel LED Driver with 12-channels, each channel supplying a stable current of 30mA. This circuit design...”
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68by Dancy, Alant'e Jaquan“... of the power management integrated circuit (PMIC). The proposed circuit is designed and fabricated in 130 nm...”
Published 2018
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69“... IC is designed and implemented. This contoller not only retains the advantage of low swtiching loss...”
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70“... IC for single-stage flyback LED driver with high power factor (PF) and low total current harmonic...”
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71“... and precision industry. The designed circuit has been successfully fabricated by using TSMC 0.35-μm CMOS process...”
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72“... and precision industry. The designed circuit has been successfully fabricated by using TSMC 0.18-μm CMOS process...”
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73“... for speech applications using SI techniques is implemented in this thesis. In this design, the mixed-mode IC...”
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74“... the requirement of modern semiconductor and precision industry. The designed circuit has been successfully...”
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75“...碩士 === 國立成功大學 === 工程科學系碩博士班 === 94 === In integrated circuit (IC) packaging, when epoxy molding...”
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76“... primary reliability issue in CMOS integrated circuit (IC) products. With more and more complicated design...”
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77“... circuit divider. The ICs are used in the fabrication, then the complication...”
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78“... inductors is also developed for the following IC design. The proposed model is to synthesize...”
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79“... and fabrication processes. Since the MEMS technology is still under-development, there is no well design rule yet...”
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80“...碩士 === 國立中山大學 === 電機工程學系研究所 === 102 === This thesis presents a new test architecture based on 3D IC...”
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