Showing 1,361 - 1,379 results of 1,379 for search 'IC DESIGN AND FABRICATION', query time: 0.68s Refine Results
  1. 1361
    ... (2D-NoC) and Three-dimensional Integrated Circuits (3D-ICs) can provide a scalable interconnection...
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    Article
  2. 1362
    ... with a DCDC converter, Booster topology. The converter was designed and fabricated using SMD (Surface...
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  3. 1363
    by Bèges, Rémi
    Published 2017
    .... To acquire more data on this fault, a testchip has been designed. It contains on-chip monitoring structures...
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  4. 1364
    ... gate length) for fabricating integrated circuits (ICs). This lithography process uses a 248nm...
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  5. 1365
    by Tao, Sha
    Published 2015
    ... (ICs) for wearable or implantable biosensors, aiming at providing personalized healthcare services...
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    Doctoral Thesis
  6. 1366
    Published 2013
    ...abstract: With increasing demand for System on Chip (SoC) and System in Package (SiP) design...
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    Doctoral Thesis
  7. 1367
    ... attention towards flexible hybrid electronics (FHE). Thin chip-foil packages fabricated by integrating ultra...
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    Article
  8. 1368
    by Wonseok Choe, Jinho Jeong
    Published 2018-10-01
    ... (ICs) in rectangular waveguides, especially at millimeter-wave and terahertz (THz) frequencies. At THz...
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    Article
  9. 1369
    by Zanette, Juliano Br?s
    Published 2018
    .... The experimental design was randomized blocks in split plots with four replications. The plots consisted...
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  10. 1370
    ... connections between different stacked chips. The 3-D technology is based on stacking several active CMOS-ICs...
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    Article
  11. 1371
    by Lam, Tam Le
    Published 2007
    ... (NLTL) was designed, fabricated and tested. Using the heterodyne technique, measurements of 0.5 Gb...
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  12. 1372
    by Lam, Tam Le
    Published 2007
    ... (NLTL) was designed, fabricated and tested. Using the heterodyne technique, measurements of 0.5 Gb...
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  13. 1373
    by Lam, Tam Le
    Published 2007
    ... (NLTL) was designed, fabricated and tested. Using the heterodyne technique, measurements of 0.5 Gb...
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  14. 1374
    by Syu, Yi-Jhe, 徐翊哲
    Published 2015
    .... Therefore, we have to increase the battery capacity and conversion efficiency, and use power management ICs...
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  15. 1375
    by Shih-Wei Tu, 涂仕煒
    Published 2008
    ...) and three-dimension integrated circuits (3-D ICs), scaled-down poly-Si TFTs are needed for higher integrated...
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  16. 1376
    by Mahmoud, Mohamed A. E.
    Published 2010
    .... Although electrostatic MPGs are the most compatible mechanism with ICs technology, many challenges face...
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  17. 1377
    by Mahmoud, Mohamed A. E.
    Published 2010
    .... Although electrostatic MPGs are the most compatible mechanism with ICs technology, many challenges face...
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  18. 1378
    by Alghamdi, Mohammad
    Published 2012
    ..., such as ICs in mobile communication systems. Among the various buck-converter architectures, switching...
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  19. 1379
    by Arumí i Delgado, Daniel
    Published 2008
    ..., an experimental chip has been designed and fabricated in a 0.35 µm technology, where full and resistive open...
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    Doctoral Thesis