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1361“... (2D-NoC) and Three-dimensional Integrated Circuits (3D-ICs) can provide a scalable interconnection...”
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1362by Alc?ntara, Sara Maria Freitas de“... with a DCDC converter, Booster topology. The converter was designed and fabricated using SMD (Surface...”
Published 2014
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1363by Bèges, Rémi“.... To acquire more data on this fault, a testchip has been designed. It contains on-chip monitoring structures...”
Published 2017
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1364
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1365by Tao, Sha“... (ICs) for wearable or implantable biosensors, aiming at providing personalized healthcare services...”
Published 2015
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Doctoral Thesis -
1366Published 2013“...abstract: With increasing demand for System on Chip (SoC) and System in Package (SiP) design...”
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Doctoral Thesis -
1367by Nagarajan Palavesam, Waltraud Hell, Andreas Drost, Christof Landesberger, Christoph Kutter, Karlheinz Bock“... attention towards flexible hybrid electronics (FHE). Thin chip-foil packages fabricated by integrating ultra...”
Published 2020-02-01
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Article -
1368“... (ICs) in rectangular waveguides, especially at millimeter-wave and terahertz (THz) frequencies. At THz...”
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1369by Zanette, Juliano Br?s“.... The experimental design was randomized blocks in split plots with four replications. The plots consisted...”
Published 2018
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1370by M. Bschorr, H.-J. Pfleiderer, P. Benkart, A. Kaiser, A. Munding, E. Kohn, A. Heittmann, H. Hübner, U. Ramacher“... connections between different stacked chips. The 3-D technology is based on stacking several active CMOS-ICs...”
Published 2006-01-01
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1371Non-invasive internal pattern extraction of integrated circuits using electrostatic force microscopyby Lam, Tam Le“... (NLTL) was designed, fabricated and tested. Using the heterodyne technique, measurements of 0.5 Gb...”
Published 2007
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1372Non-invasive internal pattern extraction of integrated circuits using electrostatic force microscopyby Lam, Tam Le“... (NLTL) was designed, fabricated and tested. Using the heterodyne technique, measurements of 0.5 Gb...”
Published 2007
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1373Non-invasive internal pattern extraction of integrated circuits using electrostatic force microscopyby Lam, Tam Le“... (NLTL) was designed, fabricated and tested. Using the heterodyne technique, measurements of 0.5 Gb...”
Published 2007
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1374Implementation of a High Efficiency SIDO Boost-Boost DC-DC Converter with Power-Distributive Control“.... Therefore, we have to increase the battery capacity and conversion efficiency, and use power management ICs...”
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1375“...) and three-dimension integrated circuits (3-D ICs), scaled-down poly-Si TFTs are needed for higher integrated...”
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1376by Mahmoud, Mohamed A. E.“.... Although electrostatic MPGs are the most compatible mechanism with ICs technology, many challenges face...”
Published 2010
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1377by Mahmoud, Mohamed A. E.“.... Although electrostatic MPGs are the most compatible mechanism with ICs technology, many challenges face...”
Published 2010
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1378by Alghamdi, Mohammad“..., such as ICs in mobile communication systems. Among the various buck-converter architectures, switching...”
Published 2012
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1379by Arumí i Delgado, Daniel“..., an experimental chip has been designed and fabricated in a 0.35 µm technology, where full and resistive open...”
Published 2008
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Doctoral Thesis