Showing 121 - 140 results of 1,379 for search 'IC DESIGN AND FABRICATION', query time: 0.46s Refine Results
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  4. 124
    by Chang Wen-Rong, 張文榮
    Published 1998
    .... It not only reduces the number of the pads in the IC, but also makes more convenient to measure the photo...
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  5. 125
    by Chang, Stella
    Published 2007
    ... of the IC. Due to the driving force of CMOS integration and low costs of silicon-based IC fabrication...
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  6. 126
    by Chang, Stella
    Published 2007
    ... of the IC. Due to the driving force of CMOS integration and low costs of silicon-based IC fabrication...
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  7. 127
    by Wei-Hsuan Lee, 李威弦
    Published 2006
    ...碩士 === 元智大學 === 通訊工程學系 === 94 === Design and Fabrication of RF Frond-end Module using System...
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  8. 128
    by Ling-Yu Ma, 馬翎瑜
    Published 2011
    ... fabrication cost, low integration compatibility with IC processes and non-transparent characteristics...
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  9. 129
    by Jung-Gen Wu, 吳榮根
    Published 2009
    ...碩士 === 國立臺北科技大學 === 機電整合研究所 === 97 === In the study, we use 0.35μm CMOS-MEMS to design cantilever...
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  10. 130
    by Chiu, Yu-Chiao, 邱鈺蛟
    Published 2014
    ...) by naturally dry oxidation, and complete the entire fabrication flow below 200 degrees. Therefore, it engaged...
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  11. 131
    by Kacker, Karan
    Published 2009
    ... interconnects are a potential solution. However, there are several design, fabrication, assembly and integration...
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  12. 132
    by Gandhi, Saumya
    Published 2015
    ... power module, starting with modeling, design, fabrication and characterization to validate 3D integrated...
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  13. 133
  14. 134
    by Ping-Kai Huang, 黃炳凱
    Published 2012
    ... in Taiwan from the upstream such as circuit design and wafer fabrication to the downstream such as packaging...
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  15. 135
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  17. 137
    by Chen Lun Chiou, 邱振倫
    Published 2001
    ... the whole processing design must be considered reasonably to prevent IC fabrication equipments from...
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  18. 138
    by Collins, Gustina B.
    Published 2014
    ...- grate these devices into standard integrated circuit (IC) process flows and minimize damage due to post...
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  19. 139
    by Wu, Tiny-Yao, 吳庭耀
    Published 2014
    ... technology because the cost and high integration level. However, the heating problem in silicon IC is still a...
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  20. 140
    ... the analysis, design, fabrication, and testing of the first axial-gap electric induction micromotor...
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