Showing 141 - 160 results of 1,379 for search 'IC DESIGN AND FABRICATION', query time: 0.69s Refine Results
  1. 141
    by Hung, Shu-Hui, 洪淑惠
    Published 2011
    ... after few decades. IC industry includes IC design, wafer fabrication, IC package , IC test and assembly...
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  2. 142
    by Xue-Da Ko, 柯學達
    Published 2013
    ... reduce the power consumption and without affect the performance for designing the IC by the Multiple...
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  3. 143
    by Tsai-Ning Wu, 吳在寧
    Published 2005
    ..., the low voltage and low power circuits would be the trend for current CMOS IC design. Pulse-Width...
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  4. 144
    by Kwon, Dongwon
    Published 2013
    ... energy transducers. The presented research objective is to develop, design, simulate, fabricate...
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  5. 145
    by Kwon, Dongwon
    Published 2015
    ... energy transducers. The presented research objective is to develop, design, simulate, fabricate...
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  6. 146
  7. 147
    by Chun-Hung Lin, 林俊宏
    Published 2003
    ...碩士 === 國立成功大學 === 工程科學系碩博士班 === 91 === In IC packaging, when epoxy molding compound(EMC)is filling...
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  8. 148
  9. 149
    by Kun-Pin Huang, 黃昆斌
    Published 2005
    ...碩士 === 國立成功大學 === 機械工程學系碩博士班 === 93 ===   The purpose of this thesis is to develop and fabricate a...
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  10. 150
    by LIN, WEI-ZHI, 林威志
    Published 2019
    ...碩士 === 國立雲林科技大學 === 機械工程系 === 108 === In this study, this work is mainly to design and fabricate...
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  11. 151
    by Wang, Wen, 王文
    Published 2015
    ... of integrated circuits (ICs) fabrication. Multiplicity enables the devices to be mass produced in thousands...
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  12. 152
  13. 153
  14. 154
  15. 155
    by Shin-Chou Hsu, 徐鑫洲
    Published 2000
    ...-and-fast functions are always the design and fabrication goals. Therefore, the required I/O pin number...
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  16. 156
    by Hung-Yi Hu, 胡宏毅
    Published 2006
    ... issues in novel circuit designs. According to the ITRS’03 report, test cost will never decrease...
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  17. 157
  18. 158
  19. 159
    by Yao-Hsiang Wang, 王耀祥
    Published 2004
    ... of sockets has been designed and fabricated for testing advanced BGA packaging. The socket can be custom...
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  20. 160
    by Ming-Hong Keng, 耿銘鴻
    Published 2013
    .... In this thesis, PRF stimulator and probeless IC Testing System are fabricated by TSMC 0.18 um 1P6M CMOS...
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