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2by CHAN, TZO YAO.Subjects: “...Integrated circuits -- Thermal properties....”
Published 1982
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3by HONG, LAZARO MANUEL.Subjects: “...Integrated circuits -- Design and construction....”
Published 1987
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5by Scappaviva, Francesco <1978>“... in the implementation of microwave circuits, have to be supported by the study and development of proper design...”
Published 2009
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Doctoral Thesis -
6by SCHOENEMAN, DONALD WARREN.Subjects: “...Integrated circuits -- Design and construction....”
Published 1985
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7by Haddadin, Baker.Subjects: “...Interconnects (Integrated circuit technology) -- Design and construction....”
Published 2009
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Others -
8by Lin, Shudong“...This thesis presents the design of a prototype chip of a 3D IC made in the Tezzaron Process...”
Published 2012
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11by O'Sullivan, Conor“... Via (TSV) induced mechanical stress in 3D integrated circuits. The chip was de- signed, layed-out...”
Published 2013
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12by O'Sullivan, Conor“... Via (TSV) induced mechanical stress in 3D integrated circuits. The chip was de- signed, layed-out...”
Published 2013
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14by Boudreault, Yves, 1959-Subjects: “...Integrated circuits -- Design and construction...”
Published 1986
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Others -
15by Panda, Uma R.Subjects: “...Integrated circuits -- Very large scale integration -- Testing....”
Published 1985
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16by Ivanov, André.Subjects: “...Integrated circuits -- Design and construction -- Data processing....”
Published 1985
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17by Zhang, Chuang“... increasingly important in integrated circuits. The low power design can increase operation time and/or utilize...”
Published 2005
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18by HO, STANLEYSubjects: “...Monolithic Microwave Integrated Circuits...”
Published 2009
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19by Blais, BrunoSubjects: “...Hybrid integrated circuits -- Inspection...”
Published 1987
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20by El Kaamouchi, Majid“... of integrated circuits up to 300°C has been demonstrated. SOI devices and circuits present advantages...”
Published 2008
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Others