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Showing 221 - 240 results of 1,495 for search 'INTEGRATED CIRCUIT PACKAGING', query time: 0.87s Refine Results
  1. 221
    EM simulation using the Laguerre-FDTD scheme for multiscale 3-D interconnections
    by Ha, Myunghyun
    Published 2012
    Subjects: “...Interconnects (Integrated circuit technology)...”
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  2. 222
    Chiplet Heterogeneous Integration Technology—Status and Challenges
    by Tao Li, Jie Hou, Jinli Yan, Rulin Liu, Hui Yang, Zhigang Sun
    Published 2020-04-01
    Subjects: “...chip integration...”
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    Article
  3. 223
    Time domain characterization of interconnect discontinuities
    by Jong, Jyh-Ming
    Published 2013
    Subjects: “...Integrated circuits...”
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  4. 224
    Characterization and Prediction of Fracture within Solder Joints and Circuit Boards
    by Nadimpalli, Siva
    Published 2011
    Subjects: “...J-integral...”
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  5. 225
    Characterization and Prediction of Fracture within Solder Joints and Circuit Boards
    by Nadimpalli, Siva
    Published 2011
    Subjects: “...J-integral...”
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  6. 226
    Response of multi-path compliant interconnects subjected to drop and impact loading
    by Bhat, Anirudh
    Published 2014
    Subjects: “...Interconnects (Integrated circuit technology)...”
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  7. 227
    Fabrication of QFN-Packaged Miniaturized GaAs-Based Bandpass Filter with Intertwined Inductors and Dendritic Capacitor
    Subjects: “...integrated passive device...”
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    Article
  8. 228
    Additively Manufactured On-Package Multipolar Antenna Systems for Harsh Communication Channels
    by Ramirez-Hernandez, Ramiro A.
    Published 2018
    Subjects: “...Package integrated antennas...”
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  9. 229
    ×12 MT angled fiber array for lateral optical coupling of a photonic integrated circuit
    by Le-Lin Chen, 陳樂霖
    Published 2019
    “... is proposed for lateral grating coupling of a Si photonic integrated circuit. The ×12 38.5o angled-fiber array...”
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  10. 230
    Commercialisation of CMOS Integrated Circuit Technology in Multi-Electrode Arrays for Neuroscience and Cell-Based Biosensors
    “...The adaptation of standard integrated circuit (IC) technology as a transducer in cell-based...”
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    Article
  11. 231
    Development of Monolithic SiGe and Packaged RF MEMS High-Linearity Five-bit High-Low Pass Phase Shifters for SoC X-band T/R Modules
    by Morton, Matthew Allan
    Published 2007
    Subjects: “...Radio frequency integrated circuits...”
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  12. 232
    Optimized Two-layer Power-ground Mesh Layout for Power Integrity Improvement on Wafer-level Package
    by Tsung-Yi Kuo, 郭宗益
    Published 2016
    “... on package; only on-chip decoupling capacitors are available. Thus the power integrity becomes more serious...”
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  13. 233
    RF signal inductors in iUHD for voltage controlled oscillators in configurable RF integrated circuits
    by Karpe, Charvak (Charvak P.)
    Published 2008
    “... integrated circuits by increasing the maximum load impedance seen by the VCO. === by Charvak Karpe. === M.Eng....”
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  14. 234
    Novel and Efficient Numerical Analysis of Packaging Interconnects in Layered Media
    by Zhu, Zhaohui
    Published 2005
    Subjects: “...Packaging Interconnect...”
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  15. 235
    Development of Low Temperature Copper to Copper Bonding Technology Platform for 3D Integrated Circuits
    by Chen, Po-Chih, 陳柏志
    Published 2019
    “.... The development of three-dimensional integrated circuit (3D IC) technology has the following advantages: short RC...”
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  16. 236
    Compact physical models for power supply noise and chip/package co-design in gigascale integration (GSI) and three-dimensional (3-D) integration systems
    by Huang, Gang
    Published 2009
    Subjects: “...Gigascale integration (GSI)...”
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  17. 237
    Signal Integrity Effects of Delay Line on Time and Frequency Domain for High-Speed Digital Circuits
    by Man-Ni Yeh, 葉曼旎
    Published 2010
    “...碩士 === 中原大學 === 電子工程研究所 === 98 === Abstract Nowadays, high-performance system packages or printed...”
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  18. 238
    Gold migration under high electrical field in Liquid Crystal Display Driver Integrated Circuit
    by Yang,Tsung-Ming, 楊宗銘
    Published 2009
    “... of LCD Driver Integrated Circuit; at the same time the requirement of LCD Driver IC package became more...”
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  19. 239
    Circuit and System Design for mm-wave Radar and Radio Applications
    by Sarkas, Ioannis
    Published 2013
    Subjects: “...packaging...”
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  20. 240
    Circuit and System Design for mm-wave Radar and Radio Applications
    by Sarkas, Ioannis
    Published 2013
    Subjects: “...packaging...”
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