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Showing 241 - 260 results of 1,495 for search 'INTEGRATED CIRCUIT PACKAGING', query time: 1.15s Refine Results
  1. 241
    Technology for 3D System Integration for Flexible Wireless Biomedical Applications
    by Wen-Cheng Kuo, Chih-Wei Huang
    Published 2018-05-01
    Subjects: “...3D package...”
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    Article
  2. 242
    A Dielectric Resonator Antenna-in-Package Design and its Electromagnetic Interference Investigation on Amplifier
    by Sheng-Jie Guo, Kwok Wa Leung, Jun-Fa Mao, Nan Yang
    Published 2018-01-01
    Subjects: “...Antenna-in-package (AiP)...”
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    Article
  3. 243
    S-parameter VLSI transmission line analysis.
    by Cooke, Bradly James.
    Published 1989
    Subjects: “...Integrated circuits -- Very large scale integration -- Design and construction...”
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  4. 244
    Integrated Current Sensor using Giant Magneto Resistive (GMR) Field Detector for Planar Power Module
    by Kim, Woochan
    Published 2014
    Subjects: “...integrated gate driver circuit...”
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  5. 245
    High-Resolution Differential Thermography of Semiconductor Edifices
    Subjects: “...integrated circuits...”
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    Article
  6. 246
    The American Institute for Manufacturing Integrated Photonics: advancing the ecosystem
    Subjects: “...photonic integrated circuits...”
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  7. 247
    Electrical Integration of SiC Power Devices for High-Power-Density Applications
    by Chen, Zheng
    Published 2013
    Subjects: “...wire-bond packaging...”
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  8. 248
    Monolithic microwave integrated circuit (MMIC) low noise amplifier (LNA) design for radio astronomy applications
    by Seyfollahi, Alireza
    Published 2018
    Subjects: “...Monolithic Microwave Integrated Circuit...”
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  9. 249
    A Judicial Cases Study on the enforcement of Integrated Circuit Layout Protection Act over Two Decades
    by YE,JIAN-LONG, 葉建龍
    Published 2016
    “...碩士 === 南臺科技大學 === 財經法律研究所 === 104 === The integrated circuits are indispensable in modern world...”
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  10. 250
    Characterization and design of embedded passive circuits for applications up to millimeter-wave frequency
    by Hwang, Seunghyun Eddy
    Published 2011
    Subjects: “...Integrated circuits...”
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  11. 251
    A Research on Business Coopetition Relationships of Integrated CircuitSubstrate Industry – U Technology Corporation as an Example
    by TEUNG-NIAN HO, 何宗年
    Published 2013
    “... research don’t dwell a relationship with coopetition in Integrated Circuit substrate industry's Value-Net...”
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  12. 252
    Applications of the Finite Difference Time Domain Method on Analyzing Signal Integrity Issues for High-Speed Circuits
    by Chun-Te Wu, 吳俊德
    Published 2002
    “... general approach has been established to account for the signal integrity issues of high speed circuits...”
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  13. 253
    Thin and Rectangular Die Bond Pick-Up Mechanism to Reduce Cracking During the Integrated Circuit Assembly Process
    by Ahmad R.A. Rahman, Nazrul Anuar Nayan
    Published 2020-09-01
    Subjects: “...integrated circuit...”
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    Article
  14. 254
    The Key Successful Factors Study of Integrated Circuit Design Enterprise: A Case Study of A Company
    by Cheng-Hung Weng, 翁政弘
    Published 2015
    “... and Fairchild Semiconductor, the number of transistors in a dense integrated circuit doubles approximately every...”
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  15. 255
    Simulation and experiment of a diamond-type micro-displacement amplifier driven by piezoelectric actuator
    Subjects: “...integrated circuit packaging...”
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    Article
  16. 256
    Integration and Fabrication Techniques for 3D Micro- and Nanodevices
    by Fischer, Andreas C.
    Published 2012
    Subjects: “...packaging...”
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    Doctoral Thesis
  17. 257
    Packaging of a High Power Density Point of Load Converter
    by Gilham, David Joel
    Published 2013
    Subjects: “...Integration...”
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  18. 258
    Intégration d'un interposeur actif silicium pour l'élaboration de circuits électroniques complexes
    by Vianne, Benjamin
    Published 2016
    Subjects: “...Intégration 3D...”
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  19. 259
    Integration of Ultra-Low Volume Pneumatic Microfluidics with a Three-Dimensional Electrode Network for On-Chip Biochemical Sensing
    Subjects: “...packaging...”
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    Article
  20. 260
    Contribució a l'estudi de l'acoblament per substrat en circuits integrats mixtes
    by Aragonès Cervera, Xavier
    Published 1997
    Subjects: “...integrated circuits...”
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    Doctoral Thesis
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