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  1. 301
    Measuring Efficiency of Fabless Integrated Circuit Design Houses by Using a Multiple Objective Programming Based Data Envelopment Analysis Approach
    by Yun-Ting Chen, 陳韻婷
    Published 2010
    “..., device packaging & test (P&T) as well as marketing and sales. In 2007, the total revenue of the fabless...”
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  2. 302
    Modeling and characterization of multiple coupled lines
    by Tripathi, Alok
    Published 2012
    Subjects: “...Integrated circuits -- Mathematical models...”
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  3. 303
    Modeling of Flip-Chip and Wire-Bond Chip Scale Packages for RF Chip-Package Co-Simulations
    by Fu-yi Han, 韓府義
    Published 2008
    “... on the performance of radio frequency integrated circuits (RFICs) for wireless applications. A model-based study...”
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  4. 304
    Port Parameter Extraction Based Self Consistent Coupled EM-Circuit FEM Solvers
    Subjects: “...Integrated circuit modeling...”
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    Article
  5. 305
    Design, Fabrication and Testing of Conformal, Localized Wafer-level Packaging for RF MEMS Devices
    by Collins, Gustina B.
    Published 2014
    Subjects: “...wafer-level packaging...”
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  6. 306
    Electronic packaging for functional electronic textiles
    by Li, Menglong
    Published 2018
    “...An electronic textile (e-textile) is a textile with integrated electronic functionality. It can...”
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  7. 307
    Research on the Influence of copper package of surfactant
    by YEN HAO-LIN, 顏豪疄
    Published 2016
    “... the environmental requirements of the wafer surface clean, to improve yield and reliability. Size integrated circuit...”
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  8. 308
    An Experimental Comparison of Galvanically Isolated DC-DC Converters: Isolation Technology and Integration Approach
    Subjects: “...integrated circuits...”
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    Article
  9. 309
    Integrated Inductors with Micro-Patterned Magnetic Thin Films for RF and Power Applications
    Published 2013
    Subjects: “...In-package...”
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    Doctoral Thesis
  10. 310
    The Application of Microprocessor on The Control of Packaging Machine
    by Yang ,Chao Kai, 楊詔剴
    Published 1995
    “... the control circuit. Since packaging machine is a system composed by mechanisms , motors...”
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  11. 311
    The Micro Stress Sensors for Electronic Packaging
    by Chung, Hsien, 鍾　賢
    Published 2010
    “... and their application on electronic packaging. The Through Silicon Via (TSV) technology brings a key to 3D integration...”
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  12. 312
    Guides d’onde Intégrés au Substrat (SIW) multicouches à haute performance pour des circuits millimétriques à faible coût
    by Parment, Frédéric
    Published 2016
    Subjects: “...Circuits passifs...”
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  13. 313
    Technology Evaluation and Selection of 3DIC Integration Using a Three-Stage Fuzzy MCDM
    by Yen-Chun Lee, C. James Chou
    Published 2016-01-01
    Subjects: “...three-dimensional integrated circuit (3DIC) integration...”
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    Article
  14. 314
    Operational Testing of 4H-SiC JFET ICs for 60 Days Directly Exposed to Venus Surface Atmospheric Conditions
    Subjects: “...JFET integrated circuits...”
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    Article
  15. 315
    TCAD simulation framework for the study of TSV-device interaction
    by Yeleswarapu, Krishnamurthy
    Published 2014
    Subjects: “...Three-dimensional integrated circuits...”
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  16. 316
    Routing Algorithms for VLSI Circuits
    by Shuenn-Shi Chen, 陳順溪
    Published 2000
    “... better than the manual design, thus it can be applied to the practical packaging of integrated circuits...”
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  17. 317
    A Non-Linear Temperature Compensation Model for Improving the Measurement Accuracy of an Inductive Proximity Sensor and Its Application-Specific Integrated Circuit Implementation
    by Li Wang, Hui-Bin Tao, Hang Dong, Zhi-Biao Shao, Fei Wang
    Published 2020-09-01
    “..., the computed distance deviation of the Application-Specific Integrated Circuit (ASIC) chips falls within...”
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    Article
  18. 318
    Circuits photoniques intégrés incluant des lasers hybrides III-V sur silicium pour applications en télécommunication très haut débit
    by Levaufre, Guillaume
    Published 2016
    Subjects: “...Circuits Photoniques Intégrés...”
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  19. 319
    On-Chip Miniaturized Bandpass Filter Using GaAs-Based Integrated Passive Device Technology For L-Band Application
    by Bao-Hua Zhu, Nam-Young Kim, Zhi-Ji Wang, Eun-Seong Kim
    Published 2019-09-01
    Subjects: “...equivalent circuit model...”
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    Article
  20. 320
    Méthodes d’évaluation du comportement des limiteurs de courant de court-circuit supraconducteurs résistifs intégrés dans des simulateurs de réseaux électriques
    by Bonnard, Charles-Henri
    Published 2017
    Subjects: “...Court-circuit...”
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