“...-Chip) and SiP (System-in-a-Package) generally. The bottleneck of SoC and SiP circuit designs...”
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“... companies make effort in signal integrity of SoC (System-on-chip) and SiP (System-in-Package) interconnects...”
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“...碩士 === 國立清華大學 === 資訊工程學系 === 97 === 系統級封裝（System in Package, SiP）因為設計簡單、容易整合以及上市時間快，所以目前大量的被業界所採用...”
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