Showing 1 - 4 results of 4 for search 'INTEGRATED CIRCUIT PACKAGING', query time: 0.40s Refine Results
  1. 1
    Mechanical Behavior Investigation of Creep and Warpage for Thin-Type three-Dimensional Integrated Circuits Packaging Structures
    by Yu-Huan Guo, 郭毓奐
    Published 2015
    “... has suffered a bottleneck in the development of a 2D packaging technology. In other words...”
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  2. 2
    Development of Equivalent Material Properties of Microbump for Simulating Chip Stacking Packaging
    by Chang-Chun Lee, Tzai-Liang Tzeng, Pei-Chen Huang
    Published 2015-08-01
    Subjects: “...3D-IC packaging...”
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    Article
  3. 3
    Effect of Wafer Level Underfill on the Microbump Reliability of Ultrathin-Chip Stacking Type 3D-IC Assembly during Thermal Cycling Tests
    by Chang-Chun Lee
    Published 2017-10-01
    Subjects: “...3D integrated circuits...”
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    Article
  4. 4
    Reliability loading impacts of 3D-ICs package on the influence investigation of Nanoscaled device performance.
    by Chien-Hsun Chen, 陳建勳
    Published 2016
    “... which predicted the developing of integrated circuit in 44 years. However, the Intel CEO Brian Krzanich...”
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