“... of LCD Driver Integrated Circuit; at the same time the requirement of LCD Driver IC package became more...”
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“... of two-dimensional packaging, three-dimensional integrated circuits gets more attention in recent years...”
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“... integrated circuit packaging. In the scale of microbumps which with the solder height below 20um, the product...”
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“... the intermetallic compounds (IMCs) are brittle and thus not good for 3D integrated circuit (IC) reliability. While...”
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“... circuits (ICs), flip-chip become main packaging technology for wafer-end jointing. In recent years...”
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“...碩士 === 國立交通大學 === 工學院半導體材料與製程設備學程 === 105 === As trends in integrated circuits miniaturization...”
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“... in device density and functionality for integrated circuits, the reliability of solder joints has become a...”
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“... founder Gordon Moore predicted that the number of transistors on integrated circuits will be doubled per...”
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