“...碩士 === 國立中山大學 === 機械與機電工程學系研究所 === 100 === Wire bonding has been used in integrated circuit...”
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“...碩士 === 國立中山大學 === 機械與機電工程學系研究所 === 101 === Since the development of high-density integrated...”
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“... to develop high-density integrated circuits （IC）, many studies of 2.5D and 3D IC packaging technology...”
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