Showing 1 - 4 results of 4 for search 'INTEGRATED CIRCUIT PACKAGING', query time: 0.68s Refine Results
  1. 1
    by Yu-Jia Li, 李育嘉
    Published 2005
    ... package with integrated character and multi-functions becomes a favorite trend in the future...
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  2. 2
    by Tsung-Yueh Tsai, 蔡宗岳
    Published 2008
    ... products and the interconnection between the electronic components and printing circuit board due...
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  3. 3
    by Chao-Yang Mao, 毛昭陽
    Published 2008
    ... package. On the other hand, the effects of control factors on the integrated objective value D...
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  4. 4
    by Chien-YuanYu, 余健源
    Published 2014
    ... technology in integrated circuit packaging due to gold price be more and more expensive. Hence, most...
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