Showing 1 - 7 results of 7 for search 'INTEGRATED CIRCUIT PACKAGING', query time: 0.55s Refine Results
  1. 1
    by Kao-Yi Wang, 王高義
    Published 2011
    ... density interconnection become more popular. Single layer substrate has not afforded the complex circuit...
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  2. 2
    by Po-Hui Yu, 余柏輝
    Published 2012
    ..., and propose the complete package equivalent circuit model. ...
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  3. 3
    by Ren-Fang Hsu, 許仁芳
    Published 2015
    ...碩士 === 國立高雄大學 === 電機工程學系碩士班 === 103 === With the technological background of system integration...
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  4. 4
    by Lung-Shu Huang, 黃榮書
    Published 2011
    ... to develop the analysis of signal integrity technology based on system level circuit. ...
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  5. 5
    by Yu-Che Tai, 戴育哲
    Published 2009
    ...碩士 === 國立高雄大學 === 電機工程學系--先進電子構裝技術產業研發碩 === 97 === Recently, the active circuit area was reduced...
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  6. 6
    by Chun-Ting Kuo, 郭俊廷
    Published 2011
    ...-in-package (SiP) applications, excellent circuit performance, and compact circuit area, the integrated...
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  7. 7
    by Jui-Wen Wang, 王瑞文
    Published 2007
    ... hole or Laser drill hole to integrate long-lost electric capacity heel substrate circuit together. Make...
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