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1“... density interconnection become more popular. Single layer substrate has not afforded the complex circuit...”
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3“...碩士 === 國立高雄大學 === 電機工程學系碩士班 === 103 === With the technological background of system integration...”
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4“... to develop the analysis of signal integrity technology based on system level circuit. ...”
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5“...碩士 === 國立高雄大學 === 電機工程學系--先進電子構裝技術產業研發碩 === 97 === Recently, the active circuit area was reduced...”
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6“...-in-package (SiP) applications, excellent circuit performance, and compact circuit area, the integrated...”
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7“... hole or Laser drill hole to integrate long-lost electric capacity heel substrate circuit together. Make...”
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