Showing 1 - 20 results of 1,219 for search 'INTEGRATED CIRCUIT PACKAGING', query time: 0.78s Refine Results
  1. 1
    The Thermal Analysis of Integrated Circuit Package
    by Yi-Chen Yen, 嚴逸塵
    Published 2000
    “...碩士 === 國立成功大學 === 機械工程學系 === 88 === The packaging process is very important in the semiconductor...”
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  2. 2
    The Integrated Circuit Packaging Scheduling Problem
    by Chiao-Yi Chen, 陳巧頤
    Published 2000
    “...碩士 === 國立交通大學 === 工業工程與管理系 === 88 === The integrated circuit packaging scheduling problem (ICPSP...”
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  3. 3
    ELECTRICAL CHARACTERISTICS OF INTEGRATED CIRCUIT PACKAGES
    by Senthinathan, Ramesh, 1961-
    Published 1987
    Subjects: “...Integrated circuits....”
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  4. 4
    Design and research of the bandwidth enhanced circuits for wire bonding in integrated circuit packaging
    by Huang Sheng Kai, 黃聖凱
    Published 2011
    “... systems and tend to make high-frequency circuit applications, as well as integrated circuit packaging...”
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  5. 5
    Multiscale EM and circuit simulation using the Laguerre-FDTD scheme for package-aware integrated-circuit design
    by Srinivasan, Gopikrishna
    Published 2008
    Subjects: “...Integrated circuits Design and construction...”
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  6. 6
    Design and implementation of an integrated VLSI packaging support software environment
    by Whipple, Thomas Driggs, 1961-
    Published 1989
    Subjects: “...Integrated circuits -- Simulation methods....”
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  7. 7
    Process Evaluation and Improvement Model of Semiconductor Integrated Circuit Packaging
    by Shih-chang Huang, 黃世章
    Published 2018
    “... integrated with the features of large capacity, high bandwidth, low power consumption, and miniaturization...”
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  8. 8
    Multiwire microstrip interconnects for high-frequency integrated circuit packaging
    by Cafaro, Nicholas Giovanni, Jr.
    Published 2007
    Subjects: “...Wire bonding (Electronic packaging)...”
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  9. 9
    Dual gate microwave devices and technologies of integrated circuits packaging
    by Ping-Lin Chen, 陳柄霖
    Published 2000
    “...,we probe into the popular package technology──Ball Grid Array . And we also probe into how the BGA...”
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  10. 10
    Electrical Modeling of Integrated-Circuit Packages Using Electromagnetic Methods
    by 何承諭
    Published 2004
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  11. 11
    Wettability of low Sn solders on integrated circuit package metallizations
    by Gabriel, Michelle Wendy
    Published 2008
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  12. 12
    Modeling and Minimization of Integrated Circuit Packaging Parasitics at Radio Frequencies
    by Benedik, Christopher
    Published 2013
    Subjects: “...integrated circuit packaging...”
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  13. 13
    The effect of die attach voiding on the thermal resistance of integrated circuit package
    by Chang, Li-hsin, 1946-
    Published 1987
    Subjects: “...Integrated circuits -- Design....”
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  14. 14
    Materials research on metallized aluminum-nitride for microelectronic packaging
    by Newberg, Carl Edward, 1962-
    Published 1988
    Subjects: “...Integrated circuits -- Materials -- Electric properties....”
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  15. 15
    Model extraction of a paddle in plastic surface-mount RF-IC packages
    by Sundberg, Garth
    Published 2012
    Subjects: “...Integrated circuits -- Packaging...”
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  16. 16
    Analysis domain truncation of interconnections in multilayer packaging structures
    by Garg, Nitin Kumar, 1967-
    Published 1989
    Subjects: “...Integrated circuits....”
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  17. 17
    Physical Design Automation for System-on-Packages and 3D-Integrated Circuits
    by Minz, Jacob Rajkumar
    Published 2007
    Subjects: “...Integrated circuits Large scale integration...”
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  18. 18
    Wideband characterization of wire bond interconnects for microwave integrated circuit packaging
    by Sutono, Albert
    Published 2007
    Subjects: “...Wire bonding (Electronic packaging)...”
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  19. 19
    Substrate Circuit Module Development and Signal-Integrity Improvement for System in Packaging
    by Kao-Yi Wang, 王高義
    Published 2011
    “... density interconnection become more popular. Single layer substrate has not afforded the complex circuit...”
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  20. 20
    Failure Analysis of Integrated Circuits Contaminated by Metal Particles in Package Process
    by 楊翔麟
    Published 2009
    “... in the integrated circuit (IC), the choice of lead-frame material and the contamination in mixing molding compound...”
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