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1by Grau, Peter F.“...<p>Packaging of high density integrated circuits offers many challenges in the electronics industry...”
Published 2014
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Dissertation -
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3by Bédard, Keven“... after the RF circuit packaging was added (8 GHz 3 dB bandwidth). This is the first PAM-8 modulation...”
Published 2016
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Dissertation -
4by Turgeon, Josyane“... of intelligent packaging capable of maintaining the integrity of consumer products throughout the cold chain...”
Published 2021
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Dissertation -
5Published 2019“... withing specified margin. The chip with ts external Power FET package is proposed to be integrated on a...”
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Dissertation -
6by Carter, Grant Russel“...Very High Speed Integrated Circuit Hardware Description Language (VHDL) is a hardware description...”
Published 2020
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Dissertation -
7Plan estratégico de marketing para el desarrollo del turismo arqueológico receptivo en la ruta Nasca“...) Specialization emphasis on ongoing training human talent in charge of offering the tour package customer e...”
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Dissertation -
8Plan estratégico de marketing para el desarrollo del turismo arqueológico receptivo en la ruta Nasca“... that integrates the various tourist destinations in the province in an attractive circuit for foreign tourists...”
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Dissertation