Showing 1 - 3 results of 3 for search 'INTEGRATED CIRCUIT PACKAGING', query time: 0.68s Refine Results
  1. 1
    Contribució a l'estudi de l'acoblament per substrat en circuits integrats mixtes
    by Aragonès Cervera, Xavier
    Published 1997
    Subjects: “...integrated circuits...”
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    Doctoral Thesis
  2. 2
    Un nou encapsulat multixip per a acceleròmetres piezoresistius
    by Collado Miguens, Anna
    Published 2003
    “... interconnection. This technique provides higher levels of integration for the packaging of sensors. In addition...”
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    Doctoral Thesis
  3. 3
    Noves estructures LTCC i HTCC per a sensors de pressió capacitius i per a sensors lambda de tipus resistiu
    “... circuits impresos en un substrat de ceràmica rígida mitjançant la tècnica de la serigrafia. Les pastes que...”
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    Doctoral Thesis
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