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  1. 1
    Inspection of Packaged Integrated Circuits using Terahertz Radiation
    by Andreas Fritz, Thomas Arnold
    Published 2014-12-01
    Subjects: “...terahertz; Time domain spectroscopy; Wavelet transformation; Wavelet denosing; packaged integrated...”
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    Article
  2. 2
    Photonic Packaging: Transforming Silicon Photonic Integrated Circuits into Photonic Devices
    Subjects: “...photonic integrated circuits (PICs)...”
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    Article
  3. 3
    Wettability of low Sn solders on integrated circuit package metallizations
    by Gabriel, Michelle Wendy
    Published 2008
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  4. 4
    Modeling and Minimization of Integrated Circuit Packaging Parasitics at Radio Frequencies
    by Benedik, Christopher
    Published 2013
    Subjects: “...integrated circuit packaging...”
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  5. 5
    Phase Change Materials for Thermal Management of IC Packages
    by P. Fiala, I. Behunek
    Published 2007-06-01
    Subjects: “...integrated circuit...”
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    Article
  6. 6
    Quasi-3D Thermal Simulation of Integrated Circuit Systems in Packages
    by Konstantin O. Petrosyants, Nikita I. Ryabov
    Published 2020-06-01
    Subjects: “...LSI packages...”
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    Article
  7. 7
    An Overview of Non-Destructive Testing Methods for Integrated Circuit Packaging Inspection
    by Pouria Aryan, Santhakumar Sampath, Hoon Sohn
    Published 2018-06-01
    Subjects: “...IC packaging...”
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    Article
  8. 8
    Capable Copper Electrodeposition Process for Integrated Circuit - Substrate Packaging Manufacturing
    Published 2018
    Subjects: “...Packaging...”
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    Doctoral Thesis
  9. 9
    Current Status of the Integrated Circuit Industry in China ― Packaging and Testing Industry Review
    by Litho World
    Published 2019-12-01
    Subjects: “...packaging...”
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    Article
  10. 10
    An integrated software package for gate array selection.
    Published 1989
    Subjects: “...Gate array circuits...”
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  11. 11
    Efficient Approach for Electrical Design and Analysis of High-Speed Interconnect in Integrated Circuit Packages
    by Myunghoi Kim, Sunkyu Kong
    Published 2020-02-01
    Subjects: “...ic package...”
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    Article
  12. 12
    Confidence Interval Based Fuzzy Evaluation Model for an Integrated-Circuit Packaging Molding Process
    by Chun-Ming Yang, Kuo-Ping Lin, Kuen-Suan Chen
    Published 2019-06-01
    Subjects: “...integrated-circuit packaging...”
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    Article
  13. 13
    Monolithically Integrated Light Feedback Control Circuit for Blue/UV LED Smart Package
    Subjects: “...wafer level LED package....”
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    Article
  14. 14
    WR-3.4 Overmoded Waveguide Module for the Packaging of a Linear Integrated-Circuit Array
    by Jeon, S., Kim, M., Kim, Y., Lee, J.
    Published 2022
    Subjects: “...integrated waveguide transition...”
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    Article
  15. 15
    Laser Written Glass Interposer for Fiber Coupling to Silicon Photonic Integrated Circuits
    Subjects: “...integrated photonics...”
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    Article
  16. 16
    Ejectorless Method for Die Attach Pick Up for Cracking Improvement on Thin High-Aspect Ratio Die
    Subjects: “...die attach, miniaturization, integrated circuit, packaging process...”
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    Article
  17. 17
    Predictive floorplanning with fixed outline constraint.
    Published 2008
    Subjects: “...Interconnects (Integrated circuit technology)...”
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  18. 18
    Interconnect-driven floorplanning.
    Published 2002
    Subjects: “...Interconnects (Integrated circuit technology)...”
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  19. 19
    Compact design of an optical phase shifter packaged with IST microheater used for integrated photonics
    Subjects: “...Photonic integrated circuit...”
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    Article
  20. 20
    Computer simulation of IC packaging effects by FDTD method.
    Published 1998
    Subjects: “...Integrated circuits--Packaging...”
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