Showing 1 - 20 results of 270 for search 'INTEGRATED CIRCUIT PACKAGING', query time: 1.06s Refine Results
  1. 1
    The Integrated Circuit Packaging Scheduling Problem
    by Chiao-Yi Chen, 陳巧頤
    Published 2000
    “...碩士 === 國立交通大學 === 工業工程與管理系 === 88 === The integrated circuit packaging scheduling problem (ICPSP...”
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  2. 2
    ELECTRICAL CHARACTERISTICS OF INTEGRATED CIRCUIT PACKAGES
    by Senthinathan, Ramesh, 1961-
    Published 1987
    Subjects: “...Integrated circuits....”
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  3. 3
    Design and implementation of an integrated VLSI packaging support software environment
    by Whipple, Thomas Driggs, 1961-
    Published 1989
    Subjects: “...Integrated circuits -- Simulation methods....”
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  4. 4
    The effect of die attach voiding on the thermal resistance of integrated circuit package
    by Chang, Li-hsin, 1946-
    Published 1987
    Subjects: “...Integrated circuits -- Design....”
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  5. 5
    Materials research on metallized aluminum-nitride for microelectronic packaging
    by Newberg, Carl Edward, 1962-
    Published 1988
    Subjects: “...Integrated circuits -- Materials -- Electric properties....”
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  6. 6
    Model extraction of a paddle in plastic surface-mount RF-IC packages
    by Sundberg, Garth
    Published 2012
    Subjects: “...Integrated circuits -- Packaging...”
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  7. 7
    Analysis domain truncation of interconnections in multilayer packaging structures
    by Garg, Nitin Kumar, 1967-
    Published 1989
    Subjects: “...Integrated circuits....”
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  8. 8
    Physical Design Automation for System-on-Packages and 3D-Integrated Circuits
    by Minz, Jacob Rajkumar
    Published 2007
    Subjects: “...Integrated circuits Large scale integration...”
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  9. 9
    Wideband characterization of wire bond interconnects for microwave integrated circuit packaging
    by Sutono, Albert
    Published 2007
    Subjects: “...Wire bonding (Electronic packaging)...”
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  10. 10
    Thermal characterization of VLSI packaging
    by Shope, David Allen, 1958-
    Published 1988
    Subjects: “...Integrated circuits -- Very large scale integration -- Thermal properties....”
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  11. 11
    Study on adhesion of underfill materials for flip chip packaging
    by Luo, Shijian
    Published 2006
    Subjects: “...Integrated circuits Reliability...”
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  12. 12
    CONDUCTIVE AND INDUCTIVE CROSSTALK COUPLING IN VLSI PACKAGES
    by Voranantakul, Suwan, 1962-
    Published 1986
    Subjects: “...Integrated circuits -- Very large scale integration....”
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  13. 13
    Algorithms-based solution for multi-stage integrated circuit packaging scheduling problem
    by Yung-Hsuan Chen, 陳勇亘
    Published 2003
    “...碩士 === 國立交通大學 === 工業工程與管理系 === 91 === The integrated circuit packaging scheduling problem (ICPSP...”
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  14. 14
    Compliant Wafer Level Package (CWLP)
    by Patel, Chirag Suryakant
    Published 2007
    Subjects: “...Integrated circuits Wafer-scale integration...”
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  15. 15
    THERMAL MODELING/SIMULATION OF LEVEL 1 AND LEVEL 2 VLSI PACKAGING
    by Jafar, Mutaz, 1960-
    Published 1986
    Subjects: “...Integrated circuits -- Very large scale integration....”
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  16. 16
    Electromigration-induced failure on lead-free micro bumps in three-dimensional integrated circuits packaging
    by Hao, Hsu, 徐皓
    Published 2012
    “... and rather smaller size, three-dimensional integrated circuit (3D IC) packaging technology is regarded as a...”
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  17. 17
    THE HIGH FREQUENCY AND TEMPERATURE DEPENDENCE OF DIELECTRIC PROPERTIES OF PRINTED CIRCUIT BOARD MATERIALS
    by Rasafar, Hamid, 1954-
    Published 1987
    Subjects: “...Integrated circuits -- Very large scale integration -- Packaging....”
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  18. 18
    HSTSS-DAC CUSTOM ICS IMPACT ON 2.75" MISSILE TELEMETRY
    Subjects: “...integrated circuits...”
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  19. 19
    Modeling, design, fabrication and characterization of glass package-to-PCB interconnections
    by Menezes, Gary
    Published 2014
    Subjects: “...Interconnects (Integrated circuit technology)...”
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  20. 20
    Transformer and System in Package for RF and Millimeter-wave Circuit Applications
    by Che-Chung Kuo, 郭哲均
    Published 2012
    “..., the miniature chip area of integrated circuit chip becomes more valuable, and the circuit designers always try...”
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