Showing 1 - 20 results of 458 for search 'INTEGRATED CIRCUIT PACKAGING', query time: 0.67s Refine Results
  1. 1
    The Thermal Analysis of Integrated Circuit Package
    by Yi-Chen Yen, 嚴逸塵
    Published 2000
    “...碩士 === 國立成功大學 === 機械工程學系 === 88 === The packaging process is very important in the semiconductor...”
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  2. 2
    Design and research of the bandwidth enhanced circuits for wire bonding in integrated circuit packaging
    by Huang Sheng Kai, 黃聖凱
    Published 2011
    “... systems and tend to make high-frequency circuit applications, as well as integrated circuit packaging...”
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  3. 3
    Process Evaluation and Improvement Model of Semiconductor Integrated Circuit Packaging
    by Shih-chang Huang, 黃世章
    Published 2018
    “... integrated with the features of large capacity, high bandwidth, low power consumption, and miniaturization...”
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  4. 4
    Dual gate microwave devices and technologies of integrated circuits packaging
    by Ping-Lin Chen, 陳柄霖
    Published 2000
    “...,we probe into the popular package technology──Ball Grid Array . And we also probe into how the BGA...”
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  5. 5
    Electrical Modeling of Integrated-Circuit Packages Using Electromagnetic Methods
    by 何承諭
    Published 2004
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  6. 6
    Substrate Circuit Module Development and Signal-Integrity Improvement for System in Packaging
    by Kao-Yi Wang, 王高義
    Published 2011
    “... density interconnection become more popular. Single layer substrate has not afforded the complex circuit...”
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  7. 7
    Failure Analysis of Integrated Circuits Contaminated by Metal Particles in Package Process
    by 楊翔麟
    Published 2009
    “... in the integrated circuit (IC), the choice of lead-frame material and the contamination in mixing molding compound...”
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  8. 8
    Development of fabrication process for integrated-circuit package using cooper as the bonding material
    by Yao-Ching Tsai, 蔡耀慶
    Published 2015
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  9. 9
    Study of thermomigration on lead-free micro bump in three-dimensional integrated circuits packaging
    by Jhu, Wei-Cheng, 朱偉誠
    Published 2013
    “... dimensional integrated circuits (3D ICs). Compared to flip chip technology, the bump height of microbumps in 3...”
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  10. 10
    Design of Microwave and Millimeter Wave Integrated Circuit Packages Using 3D Technology
    by Yu-Chih Lin, 林宇志
    Published 2012
    “... operations. We realized on printed circuit board a grounded coplanar waveguide (CPWG) and on gallium arsenic...”
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  11. 11
    Power Integrity Analysis for High-Speed Circuit Package Using Transmission Line Method
    by Ming-Fong Jhong, 鍾明峰
    Published 2006
    “... a critical factor to degrade the signal integrity (SI) and power integrity (PI) in PCB or package...”
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  12. 12
    Evaluating performance of Integrated Circuit Packaging and Testing Firms -Application DEA and Bootstrap DEA
    by Yu, Kuei-Ching, 游桂靜
    Published 2013
    “...碩士 === 明道大學 === 產業創新與經營學系碩士班 === 101 === Taiwan’s Integrated Circuit Packaging and Testing (ICPT...”
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  13. 13
    Optimization of Water Recycling Strategy for an Integrated-Circuit Packaging Fab:A Scenario-Base Analysis
    by Lu, Bo-hsun, 呂柏勳
    Published 2018
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  14. 14
    Mechanical Behavior Investigation of Creep and Warpage for Thin-Type three-Dimensional Integrated Circuits Packaging Structures
    by Yu-Huan Guo, 郭毓奐
    Published 2015
    “... has suffered a bottleneck in the development of a 2D packaging technology. In other words...”
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  15. 15
    The Use of Taguchi Method for the Robust Parameters Design Problems from Integrated-Circuit Packaging Quality Inspection Process
    by I-ChengPan, 潘奕成
    Published 2014
    “... in the Integrated-Circuits（IC）and testing industry. This research investigates that package visual inspection...”
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  16. 16
    The System-level Package Effect Research and Modeling by Packaging Integrated Passive Device
    by Po-Hui Yu, 余柏輝
    Published 2012
    “..., and propose the complete package equivalent circuit model. ...”
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  17. 17
    The model of temperature distribution in integrated circuits
    by Jei-feng Hwang, 黃志豐
    Published 1995
    “...碩士 === 國立清華大學 === 電機工程研究所 === 83 === The design of power integrated circuits (PIC) is strongly...”
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  18. 18
    A Study of the Protection of Intellectual Property Rights of Circuit Layouts of Integrated Circuits
    by Fan Rung Jung, 范容榕
    Published 2015
    “... the integrated circuit foundries of Taiwan and the packaging and testing of integrated circuit industry in Taiwan...”
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  19. 19
    An Integrated Resistance Welding and TSV Process for Microsystems Packaging
    by Lien, Jui-Chien, 練瑞虔
    Published 2011
    “... for integrated circuits (IC) and microelectromechanical system (MEMS) devices. In this method, two wafers were...”
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  20. 20
    Implementation of An Automatic Integrated Circuit Detection System
    by Jen-Nan Lo, 羅仁南
    Published 2005
    “... detection mode of I/O port in this thesis and it can be used for the IC package processing. This mode...”
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