Inspection of Packaged Integrated Circuits using Terahertz Radiation

by Andreas Fritz, Thomas Arnold
Published 2014-12-01

Photonic Packaging: Transforming Silicon Photonic Integrated Circuits into Photonic Devices

by Lee Carroll, Jun-Su Lee, Carmelo Scarcella, Kamil Gradkowski, Matthieu Duperron, Huihui Lu, Yan Zhao, Cormac Eason, Padraic Morrissey, Marc Rensing, Sean Collins, How Yuan Hwang, Peter O’Brien
Published 2016-12-01

Phase Change Materials for Thermal Management of IC Packages

by P. Fiala, I. Behunek
Published 2007-06-01

Quasi-3D Thermal Simulation of Integrated Circuit Systems in Packages

by Konstantin O. Petrosyants, Nikita I. Ryabov
Published 2020-06-01

An Overview of Non-Destructive Testing Methods for Integrated Circuit Packaging Inspection

by Pouria Aryan, Santhakumar Sampath, Hoon Sohn
Published 2018-06-01

Current Status of the Integrated Circuit Industry in China ― Packaging and Testing Industry Review

by Litho World
Published 2019-12-01

Efficient Approach for Electrical Design and Analysis of High-Speed Interconnect in Integrated Circuit Packages

by Myunghoi Kim, Sunkyu Kong
Published 2020-02-01

Confidence Interval Based Fuzzy Evaluation Model for an Integrated-Circuit Packaging Molding Process

by Chun-Ming Yang, Kuo-Ping Lin, Kuen-Suan Chen
Published 2019-06-01

Monolithically Integrated Light Feedback Control Circuit for Blue/UV LED Smart Package

by Zahra Kolahdouz Esfahani, Massoud Tohidian, Henk van Zeijl, Mohammadreza Kolahdouz, Guoqi Zhang
Published 2017-01-01

Laser Written Glass Interposer for Fiber Coupling to Silicon Photonic Integrated Circuits

by A. Desmet, A. Radosavljevic, J. Missinne, D. Van Thourhout, G. Van Steenberge
Published 2021-01-01

Ejectorless Method for Die Attach Pick Up for Cracking Improvement on Thin High-Aspect Ratio Die

by Ahmad Ridzuan Bin Abd Rahman, Nazrul Anuar Nayan
Published 2020-07-01

Compact design of an optical phase shifter packaged with IST microheater used for integrated photonics

by Zizheng Li, Hongyao Chen, Jianping Wang, Huimin Lu, Changling Liu
Published 2020-12-01

Extreme environment interconnects and packaging for power electronics

by Alberto Campos-Zatarain, Jack Hinton, Maria Mirgkizoudi, Jing Li, Russell Harris, Robert W. Kay, David Flynn
Published 2019-04-01

800 MB/s DDR NAND Flash Memory Multi-Chip Package With Source-Synchronous Interface for Point-to-Point Ring Topology

by Peter Gillingham, David Chinn, Eric Choi, Jin-Ki Kim, Don Macdonald, Hakjune Oh, Hong-Beom Pyeon, Roland Schuetz
Published 2013-01-01

Research on intergenerational and development of hybrid integration technology

by Zhu Yusheng, Shi Jing, Chen Cheng
Published 2021-04-01

Fan-Out Wafer and Panel Level Packaging as Packaging Platform for Heterogeneous Integration

by Tanja Braun, Karl-Friedrich Becker, Ole Hoelck, Steve Voges, Ruben Kahle, Marc Dreissigacker, Martin Schneider-Ramelow
Published 2019-05-01

3D MICROPACKAGING OF INTEGRATED CIRCUITS

by Băjenescu, Titu-Marius I.
Published 2020-03-01

Hybrid Systems-in-Foil—Combining the Merits of Thin Chips and of Large-Area Electronics

by Joachim N. Burghartz, Golzar Alavi, Bjorn Albrecht, Thomas Deuble, Mourad Elsobky, Saleh Ferwana, Christine Harendt, Yigit Mahsereci, Harald Richter, Zili Yu
Published 2019-01-01

3D Integrated Circuit Cooling with Microfluidics

by Shaoxi Wang, Yue Yin, Chenxia Hu, Pouya Rezai
Published 2018-06-01

Three-Dimensional Package Design for Electro-Absorption Modulation Laser Array

by Zhike Zhang, Yu Liu, Jiasheng Wang, Jinhua Bai, Haiqing Yuan, Xin Wang, Jianguo Liu, Ninghua Zhu
Published 2016-01-01