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Showing 181 - 200 results of 1,495 for search 'INTEGRATED CIRCUIT PACKAGING', query time: 1.42s Refine Results
  1. 181
    Real-time automated visual inspection of integrated circuit wire-bonds
    by Mandava, R.
    Published 1995
    “... circuit die and the leads of the package that carries the die. With the most sophisticated bonding...”
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  2. 182
    Interband Cascade Photonic Integrated Circuits on Native III-V Chip
    Subjects: “...photonic integrated circuit...”
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    Article
  3. 183
    Reducing signal coupling and crosstalk in monolithic, mixed-signal integrated circuits
    by Clewell, Matthew John
    Published 2014
    “... of mixed-signal systems must understand coupling mechanisms at the system, PC board, package and integrated...”
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  4. 184
    Optimal signal, power, clock and thermal interconnect networks for high-performance 2d and 3d integrated circuits
    by Sekar, Deepak Chandra
    Published 2009
    Subjects: “...Integrated circuits...”
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  5. 185
    Integration of Voltage Source Converters in Steady-State RMS Short-Circuit Analysis
    by Carlos Coelho Teixeira, Helder Leite
    Published 2021-06-01
    Subjects: “...short-circuit analysis...”
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    Article
  6. 186
    Inductors in high-performance silicon radio frequency integrated circuits : analysis, modeling, and design considerations
    by Lutz, Richard D. Jr
    Published 2012
    Subjects: “...Radio frequency integrated circuits -- Mathematical models...”
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  7. 187
    System-level design and RF front-end implementation for a 3-10ghz multiband-ofdm ultrawideband receiver and built-in testing techniques for analog and rf integrated circuits
    by Valdes Garcia, Alberto
    Published 2007
    Subjects: “...RF Integrated Circuits...”
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  8. 188
    Electrical Modeling and Design for Signal Integrity of Area-Array Vertical Interconnects in Electronic Packaging
    by Ruey-Bo Sun, 孫瑞伯
    Published 2011
    “... of electronic packaging, the electrical modeling and designs for signal integrity (SI) of vertical interconnects...”
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  9. 189
    Analysis, Diagnosis and Design for System-level Signal and Power Integrity in Chip-package-systems
    by Ambasana, Nikita
    Published 2018
    Subjects: “...Power Integrity...”
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  10. 190
    System Power Integrity Impact by Package Power/Ground Balls Assignment and Decoupling Capacitors
    “... ball is often used as a link between the package and printed circuit board (PCB). The resonance between...”
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  11. 191
    Signal Integrity Design for High Speed SerDes Interface in Wafer Level Package
    by Po-Yu Chang, 張伯瑜
    Published 2017
    “...碩士 === 國立臺灣大學 === 電信工程學研究所 === 105 === This thesis presents power and signal integrity model...”
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  12. 192
    Copper to copper bonding by nano interfaces for fine pitch interconnections and thermal applications
    by Jha, Gopal Chandra
    Published 2008
    Subjects: “...Interconnects (Integrated circuit technology)...”
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  13. 193
    Design-for-manufacturability (DFM) for system-in-package (SiP) applications
    by Doppalapudi, Ranjeeth
    Published 2009
    Subjects: “...Computer integrated manufacturing systems...”
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  14. 194
    3D-Via Driven Partitioning for 3D VLSI Integrated Circuits
    “... and packaging technologies allowed interconnecting stacked 2D circuits by using 3D vias. However, 3D-vias can...”
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    Article
  15. 195
    Modélisation, caractérisation et analyse de systèmes de PLL intégrés, utilisant une approche globale puce-boîtier-circuit imprimé
    by Ranaivoniarivo, Manohiaina
    Published 2011
    Subjects: “...Co-simulation puce-boîtier-circuit imprimé...”
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  16. 196
    Prolonged silicon carbide integrated circuit operation in Venus surface atmospheric conditions
    “...The prolonged operation of semiconductor integrated circuits (ICs) needed for long-duration...”
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    Article
  17. 197
    Integrated antennas on organic packages and cavity filters for millimeter-wave and microwave communications systems
    by Amadjikpe, Arnaud Lucres
    Published 2012
    Subjects: “...Packaging...”
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  18. 198
    Signal and power integrity co-simulation using the multi-layer finite difference method
    by Bharath, Krishna
    Published 2009
    Subjects: “...Interconnects (Integrated circuit technology)...”
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  19. 199
    MONITORING OF IC ENCAPSULATION PROCESS
    Subjects: “...integrated circuits...”
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    Article
  20. 200
    High-Reliability and Low-Capacitance Bond Pad Design for CMOS Integrated Circuits
    by Peng, Jeng-Jie, 彭政傑
    Published 2002
    “...碩士 === 國立交通大學 === 電資學院學程碩士班 === 90 === Wire bond package is still the mainstream of IC packages...”
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