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  1. 201
    Accurate Models for Evaluating the Direct Conducted and Radiated Emissions from Integrated Circuits
    Subjects: “...integrated circuits...”
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    Article
  2. 202
    Modeling and Evaluating Lead-frame CSPs for Radio-Frequency Integrated Circuit Applications
    by Hui-Hsiang Huang, 黃輝祥
    Published 2001
    “... chip carrier(BCC) packages. In the simulation, the Ansoft HFSS simulator was used to calculate...”
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  3. 203
    PCSIM: a parallel simulation environment for neural circuits fully integrated with Python
    by Dejan Pecevski, Thomas Natschläger, Klaus Schuch
    Published 2009-05-01
    “...The Parallel Circuit SIMulator (PCSIM) is a software package for simulation of neural circuits...”
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    Article
  4. 204
    Energy efficient active cooling of integrated circuits using embedded thermoelectric devices
    “.... The feasibility of the integration of the TEM and the automated mode switching within the microprocessor package...”
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  5. 205
    Analysis and applications of layered multiconductor coupled slot and strip-slot structures
    by Luo, Sifen
    Published 2013
    Subjects: “...Microwave integrated circuits...”
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  6. 206
    An Ultra-Wideband Compact TR Module Based on 3-D Packaging
    by Zhiqiang Li, Houjun Sun, Hongjiang Wu, Shuai Zhang
    Published 2021-06-01
    Subjects: “...3-D integrated packaging...”
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    Article
  7. 207
    Synthesis of tin, silver and their alloy nanoparticles for lead-free interconnect applications
    by Jiang, Hongjin
    Published 2008
    Subjects: “...Interconnects (Integrated circuit technology)...”
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  8. 208
    QFN-Packaged Bandpass Filter With Intertwined Circular Spiral Inductor and Integrated Center-Located Capacitors Using Integrated Passive Device Technology
    Subjects: “...integrated passive device...”
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    Article
  9. 209
    Investigating the Temperature Effect of Reliability on Integration IC 3D Packaging under Drop Test
    by chen, hao chih, 陳顥之
    Published 2013
    “...., three-dimensional integrated circuit package. The main advantages of three-dimensional integrated...”
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  10. 210
    Tungsten Probe Measuring System of Unpackaged Integration Circuit Chip and Related Process Technology
    by Jin-Yea Wang, 王敬業
    Published 2000
    “... to the more and more small, modern wafer level packaging has to be developed. This technology cost much more...”
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  11. 211
    Preliminary Study on the Integration of Equipment Automation and Intelligent System in Semiconductor Packaging and Measurement Manufacturing Industry
    by TSUO-YU HSU, 許作宇
    Published 2019
    “...碩士 === 國立臺灣科技大學 === 管理研究所 === 107 === The application of integrated circuits is very extensive...”
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  12. 212
    Design and Development of Monolithic Microwave Integrated Amplifiers and Coupling Circuits for Telecommunication Systems Applications
    by R. Makri, M. Gargalakos, N. K. Uzunoglu
    Published 2002-01-01
    “...Recent advances in printed circuit and packaging technology of microwave and millimeter wave...”
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    Article
  13. 213
    Vector Finite Element Optimisation Of Compact Spot-size Converters In Photonics Integrated Circuits
    by Ladele, Emmanuel Olufemi
    Published 2006
    “... have been made to close the gap and reduce such a high loss when coupling a photonic integrated circuit...”
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  14. 214
    Thermo-Mechanical Reliability of Micro-Interconnects in Three-Dimensional Integrated Circuits: Modeling and Simulation
    by Rodriguez, Omar
    Published 2010
    Subjects: “...Integrated Circuits...”
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  15. 215
    The Dual Use of Power Distribution Networks for Data Communications in High Speed Integrated Circuits
    by Chung, Woo Cheol
    Published 2014
    Subjects: “...Integrated Circuits...”
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  16. 216
    Study and Implementation of Automatic Gain Control, High Voltage Integrated Circuits, and Backplane Transceiver
    by Shang-Hsien Yang, 楊上賢
    Published 2011
    “... imposed by integrating analog and high voltage devices in standard CMOS processes, this thesis aims...”
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  17. 217
    DesignTag : a system for identifying and protecting intellectual property within integrated circuits
    by McLaren, David
    Published 2010
    “... intellectual property (IP) within operating integrated circuits (ICs). The ability to accurately identify IP...”
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  18. 218
    Detecting misuse of intellectual property and counterfeit integrated circuits using thermal communication channels
    by Marsh, Carol
    Published 2011
    “... the IP via the digital device package and thus requires no prior knowledge of the system. The method...”
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  19. 219
    Microfabrication and post-CMOS integration techniques for a reconfigurable wafer-sized circuit board
    by Radji, Moufid
    Published 2010
    “...). The user can simply deposit packaged integrated circuits on the smart active surface, and then a complex...”
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  20. 220
    Electrical and fluidic interconnect design and technology for 3D ICS
    by Zaveri, Jesal
    Published 2011
    Subjects: “...Three-dimensional integrated circuits...”
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