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Showing 61 - 80 results of 1,495 for search 'INTEGRATED CIRCUIT PACKAGING', query time: 1.15s Refine Results
  1. 61
    Development of time domain characterization methods for packaging structures
    by Pannala, Sreemala
    Published 2007
    Subjects: “...Integrated circuits Measurement...”
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  2. 62
    Electrical effects of CMOS circuit packaging
    by Zell, Christopher William
    Published 1996
    “..., and high I/O counts of CMOS integrated circuits make them particularly susceptible to excessive...”
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  3. 63
    THE HIGH FREQUENCY AND TEMPERATURE DEPENDENCE OF DIELECTRIC PROPERTIES OF PRINTED CIRCUIT BOARD MATERIALS
    by Rasafar, Hamid, 1954-
    Published 1987
    Subjects: “...Integrated circuits -- Very large scale integration -- Packaging....”
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  4. 64
    High throughput flip chip assembly process application and assessment using no-flow underfill materials
    by Milner, David William
    Published 2007
    Subjects: “...Integrated circuits...”
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  5. 65
    Computer simulation of multiple coupled transmission lines in electronic packaging application.
    by Liao, Jen-Chyi.
    Published 1989
    Subjects: “...Integrated circuits -- Computer simulation....”
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  6. 66
    Mechanical Behavior Investigation of Creep and Warpage for Thin-Type three-Dimensional Integrated Circuits Packaging Structures
    by Yu-Huan Guo, 郭毓奐
    Published 2015
    “... has suffered a bottleneck in the development of a 2D packaging technology. In other words...”
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  7. 67
    Modeling of power supply noise in large chips using the finite difference time domain method
    by Choi, Jinseong
    Published 2007
    Subjects: “...Integrated circuits Design and construction...”
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  8. 68
    All-copper chip-to-substrate interconnects for high performance integrated circuit devices
    by Osborn, Tyler Nathaniel
    Published 2009
    Subjects: “...Interconnects (Integrated circuit technology)...”
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  9. 69
    Predictive floorplanning with fixed outline constraint.
    Published 2008
    Subjects: “...Interconnects (Integrated circuit technology)...”
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  10. 70
    Interconnect-driven floorplanning.
    Published 2002
    Subjects: “...Interconnects (Integrated circuit technology)...”
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  11. 71
    Study of thermo-mechanical reliability of area-array packages
    by Hanna, Carlton Eissey
    Published 2007
    Subjects: “...Integrated circuits Design and construction...”
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  12. 72
    Compact design of an optical phase shifter packaged with IST microheater used for integrated photonics
    Subjects: “...Photonic integrated circuit...”
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    Article
  13. 73
    Physics-based modeling methodology for reliability of microvias
    by Ramakrishna, Gnyaneshwar
    Published 2007
    Subjects: “...Integrated circuits Design and construction...”
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  14. 74
    HSTSS-DAC CUSTOM ICS IMPACT ON 2.75" MISSILE TELEMETRY
    Subjects: “...integrated circuits...”
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  15. 75
    Computer simulation of IC packaging effects by FDTD method.
    Published 1998
    Subjects: “...Integrated circuits--Packaging...”
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  16. 76
    The Use of Taguchi Method for the Robust Parameters Design Problems from Integrated-Circuit Packaging Quality Inspection Process
    by I-ChengPan, 潘奕成
    Published 2014
    “... in the Integrated-Circuits（IC）and testing industry. This research investigates that package visual inspection...”
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  17. 77
    Fatigue modeling of nano-structured chip-to-package interconnections
    by Koh, Sau W.
    Published 2009
    Subjects: “...Interconnects (Integrated circuit technology)...”
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  18. 78
    Modeling and simulation for signal and power integrity of electronic packages
    by Choi, Jae Young
    Published 2013
    Subjects: “...Integrated circuits...”
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  19. 79
    Modeling and simulation of embedded passives using rational functions in multi-layered substrates
    by Choi, Kwang Lim
    Published 2007
    Subjects: “...Integrated circuits Mathmatical models...”
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  20. 80
    Fundamentals of area array solder interconnect yield
    by Kim, Chunho
    Published 2007
    Subjects: “...Interconnect (Integrated circuit technology)...”
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