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Showing 121 - 140 results of 1,495 for search 'INTEGRATED CIRCUIT PACKAGING', query time: 0.73s Refine Results
  1. 121
    Decoupling Effect Study of Power Integrity on Package Substrate
    by Jui-Cheng Huang, 黃瑞呈
    Published 2008
    “... the power noise are minimum, meanwhile, the power is stable and integrated circuits (IC) are normal...”
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  2. 122
    Characterization and electrical circuit modeling of interconnections and packages using time domain network analysis
    by Hayden, Leonard
    Published 2012
    Subjects: “...Electric circuits -- Mathematical models...”
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  3. 123
    Routability optimization with buffer planning in floorplan design.
    Published 2002
    Subjects: “...Integrated circuits--Very large scale integration...”
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  4. 124
    Design and Analyses of a Dimple Array Interconnect Technique for Power Electronics Packaging
    by Wen, Sihua
    Published 2014
    Subjects: “...flexible circuit...”
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  5. 125
    Electrical Characteristics Analyzing of Package Material and Electromagnetic Interference Suppression Research with Active Circuit
    by Yu-yung Wu, 吳俞詠
    Published 2015
    “..., the characteristics of circuit are changed. Therefore, power integrity issues become the primary solution designers...”
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  6. 126
    Electroplated multi-path compliant copper interconnects for flip-chip packages
    by Okereke, Raphael Ifeanyi
    Published 2014
    Subjects: “...Interconnects (Integrated circuit technology)...”
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  7. 127
    Using discrete-event simulation approach in solving a real-time capacity planning problem—A case study on the Molding area of an integrated-circuits packaging plant
    by Chunwei Yang, 楊君威
    Published 2001
    “...碩士 === 國立成功大學 === 製造工程研究所 === 89 === Semi-conductor packaging plant is a typical labor-substitute...”
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  8. 128
    Electromigration analysis of high current carrying adhesive-based copper-to-copper interconnections
    by Khan, Sadia Arefin
    Published 2012
    Subjects: “...Interconnects (Integrated circuit technology)...”
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  9. 129
    Modeling of Electrical Characteristics and Analysis of Signal Integrity for Electronic Packages
    by Shinn-Jong Li, 李信忠
    Published 2000
    “... are compared to establish a proper equivalent circuit model for the BGA package. Finally, the signal integrity...”
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  10. 130
    Polysilicon and Amorphous Silicon Microbolometers with Integrated and Discrete Circuit
    by Jin - Hong Wang, 王晉宏
    Published 2016
    “... of resistance (TCR) is about -2%/oC, and used LED to display finally result. Besides, an readout integrated...”
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  11. 131
    Advanced packaging and integration solutions for enhanced performance power convertors
    by Solomon, Adane Kassa
    Published 2015
    “...The design of novel solutions for packaging and integration of power semiconductor devices...”
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  12. 132
    A Study on Signal Integrity of Fine Lines in Package Substrate
    by Po-I Wu, 吳柏毅
    Published 2015
    “... of circuit gets higher year by year. In order to increase the amount of transmitted information in limited...”
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  13. 133
    Integrated circuit outlier identification by multiple parameter correlation
    by Sabade, Sagar Suresh
    Published 2004
    “... is nontrivial. To avoid wasted investment in packaging or further testing it is important to screen defective...”
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  14. 134
    Design automation and analysis of three-dimensional integrated circuits
    by Das, Shamik, 1977-
    Published 2005
    “...-aided design flow for the digital components of a three-dimensional integrated circuit (3-D IC...”
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  15. 135
    Development of Heterogeneous Integration Technology for RF System-on-Package Applications
    by Chao, Tzu-Yuan, 趙子元
    Published 2012
    “... to further shrink a bulky circuit board assembled with components into a miniature packaging substrate...”
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  16. 136
    Automated Wiring Analysis of Integrated Circuit Geometric Data
    by Lang, Charles Richard
    Published 1979
    “...<p>Methods are presented by which wiring data of an NMOS integrated circuit may be extracted from...”
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  17. 137
    Failure Analysis of Integrated Circuit Products and Techniques Comparison
    by Ying-ShuWang, 王英樹
    Published 2013
    “... comparison of IC (integrated circuit) products. IC products can be seen everywhere nowadays, because...”
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  18. 138
    Processing of no-flow fluxing uderfills for flip chip assembly
    by Lazarakis, Theodoros L.
    Published 2007
    Subjects: “...Integrated circuits Design and construction...”
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  19. 139
    Novel conductive adhesives for electronic packaging applications: a way towards economical, highly conductive, low temperature and flexible interconnects
    by Zhang, Rongwei
    Published 2011
    Subjects: “...Interconnects (Integrated circuit technology)...”
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  20. 140
    Three-Dimensional Package Design for Electro-Absorption Modulation Laser Array
    Subjects: “...three-dimension package...”
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    Article
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