Showing 141 - 160 results of 1,495 for search 'INTEGRATED CIRCUIT PACKAGING', query time: 1.19s Refine Results
  1. 141
    by Seo, Chung-Seok
    Published 2005
    Subjects: ...Application specific integrated circuits Design and construction...
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  2. 142
  3. 143
    by Chen, Andrea
    Published 2012
    Subjects: ...Circuits & components bicssc...
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    eBook
  4. 144
  5. 145
    by Sin-Ting Chen, 陳信廷
    Published 2006
    ... of the simultaneous switching noise (SSN) problems in the power delivery networks (PDN) of high-speed digital circuit...
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  6. 146
  7. 147
  8. 148
    by Chien-Ying Chu, 朱劍英
    Published 2013
    ... reduce the packaging costs and make sure that the products conform to the specifications of the client...
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  9. 149
    by Xin Mu, Sailong Wu, Lirong Cheng, H.Y. Fu
    Published 2020-02-01
    ... fabrication process. Optical interconnects is an important issue in silicon photonic integrated circuits...
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    Article
  10. 150
    by Yen-chieh Wang, 王彥傑
    Published 2016
    .... This FOG photonic integrated circuit (PIC) is designed based on Smart Photonics InP/InGaAsP generic...
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  11. 151
  12. 152
    by 陳君瑜
    Published 2014
    ..., these additions increase packaging volume, integral complexity and cost. To address the above problems, a silicon...
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  13. 153
  14. 154
    by Lu Wen-Chao, 呂文超
    Published 1998
    .... Besides, the effects of EMI and package on device behavior are studied by using the SPICE software.It...
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  15. 155
  16. 156
    by Tseng, Su-Peng, 曾恕鵬
    Published 2010
    ...碩士 === 國立交通大學 === 工學院碩士在職專班半導體材料與製程設備組 === 99 === Abstract High Voltage Integrated Circuit (HVIC...
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  17. 157
    by LIN, MING-WEI, 林明葦
    Published 2016
    ..., the more the categories and capabilities of 3C electronic products have, the more complicate the circuit...
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  18. 158
    by Holik, Sonia Maria
    Published 2010
    ...The design and physical verification of contemporary integrated circuits is a challenging task due...
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  19. 159
    by Ahmad, Tahir
    Published 1998
    ... the Mathematica package. Experimental work was also carried out to investigate the characteristic of crosstalk...
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  20. 160
    by Sutherland, David B.
    Published 2010
    Subjects: ...Microwave circuits -- Design and construction...
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