Showing 161 - 180 results of 1,495 for search 'INTEGRATED CIRCUIT PACKAGING', query time: 0.84s Refine Results
  1. 161
    ... the laboratory. This thesis describes the development of solid-state spin-integrated circuits (S3IC) for quantum...
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  2. 162
    by Deutsch, Sergej
    Published 2015
    ... integrated circuits (3D ICs). A number of challenges associated with 3D test need to be addressed before 3D...
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  3. 163
  4. 164
    Published 2003
    Subjects: ...Integrated circuits--Very large scale integration--Design and construction...
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  5. 165
    by Thompson, Dane C.
    Published 2006
    Subjects: ...Radio frequency integrated circuits Design and construction...
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  6. 166
  7. 167
    by Dian-Chi Li, 李典錡
    Published 2005
    ... Circuits with Flip-Chip Package Technology and Distributed Amplifier Design School:National Central...
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  8. 168
    by Chen, Da-Chang, 陳達昌
    Published 1997
    ... in an integrated circuit fabrication plant wasexplored. First, the manufacturing process...
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  9. 169
    Published 2013
    ... as Second Level Interconnects (SLI) in mounting packaged components to the printed circuit board (PCB...
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    Doctoral Thesis
  10. 170
    by Kai-Bin Wu, 吳凱斌
    Published 2017
    ..., with the trends of the slim, low-power, and high bandwidth features. The three-dimensional integration...
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  11. 171
    by Kai-Cheng Shie, A.M. Gusak, K.N. Tu, Chih Chen
    Published 2021-11-01
    Subjects: ...Three-dimensional integrated circuits...
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    Article
  12. 172
  13. 173
    by Lithotechsolutions.org
    Published 2018-08-01
    ... including design, manufacturing, special equipment, materials, packaging and testing. The article series...
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    Article
  14. 174
    by Yi-Lung Cheng, 鄭義榮
    Published 2004
    ... vapor deposition (PE-CVD) low-k films is required for circuit speed and package. Low-k films deposited...
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  15. 175
    by YEH,CHEN-CHUN, 葉宸郡
    Published 2018
    ... between the stage of integrated circuit design and stage of production. In the industry, executives...
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  16. 176
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  19. 179
    by TSUNG-SHUN CHANG, 張淙舜
    Published 2012
    ... technology, the operation frequency and functions of Integrated Circuit is increasing so that cause...
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  20. 180
    by Jin Si Han, 金思漢
    Published 1998
    ... BiCMOS integrated circuits is presented in this paper. Suppose that EMI signals have been coupled into a...
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