“... of product commercialization. Green packaging design can reduce not only waste but also the cost...”
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“... for future packaging. This study is based on the experimental design method for the production of new...”
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“... IC design houses outsource most of their production and inventory to subcontractors...”
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“...碩士 === 國立交通大學 === 管理學院工業工程與管理學程 === 108 === Wafer Level Package(WLP), is one of the sections...”
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“... after few decades. IC industry includes IC design, wafer fabrication, IC package , IC test and assembly...”
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“...碩士 === 國立交通大學 === 管理學院碩士在職專班工業工程與管理組 === 98 === For electronic packaging, BGA (Ball Grid Array...”
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