“...碩士 === 華梵大學 === 工業工程與經營資訊學系碩士班 === 93 === In the electronics packaging, Surface Mount Technology...”
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“... products toward the increased functionality and end product size/weight miniaturation. The above mentioned...”
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“... products has resulted in extreme complexity in the packaging and assembly technology. The solder balls...”
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“... electronic products worldwide. Major manufacturers in USA and Japan such as IBM, COMPACQ, TOSHIBA, have...”
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“... printing process and lack of quality control. This study investigated the quad flat package (QFP...”
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“...碩士 === 華梵大學 === 工業工程與經營資訊學系碩士班 === 95 === Portable electronic product such as digital camera, smart...”
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