Showing 1 - 13 results of 13 for search 'PACKAGING DESIGN AND PRODUCTION', query time: 0.84s Refine Results
  1. 1
    by Yu-Jia Li, 李育嘉
    Published 2005
    ... weight and high density of electronic products, the traditional single chip package has no longer met...
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  2. 2
    by Yue-Zhe Xie, 謝岳哲
    Published 2008
    ... packages, the most significant factors are chosen by the fractional factorial design method...
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  3. 3
    by Chia-Hao Chang, 張家豪
    Published 2007
    ... life over the original design, far improving the reliability of QFN module package. ...
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  4. 4
    by Chia-MingLin, 林家民
    Published 2012
    ... to increase the fatigue life of the package by 86.5% compared to that of the original design ...
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  5. 5
    by Hung-ShengJiang, 姜宏昇
    Published 2012
    ... of semiconductors for the electronic products, the electronic packaging has been focused on the technology of multi...
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  6. 6
    by c-jChen, 陳昌榮
    Published 2010
    ... density and the fatigue life of the package, the single-factor design analysis on the Direct Chip Attach...
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  7. 7
    by Hsueh-LiangChu, 朱學良
    Published 2013
    ... performance, low cost and multi-functions in electronics industries, the Package-on-package (PoP) stacking...
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  8. 8
    by Yi-LunLin, 林逸倫
    Published 2013
    ...碩士 === 國立成功大學 === 工程科學系碩博士班 === 101 === In recent years, the electronic products have been well...
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  9. 9
    by Kuei-YuanHuang, 黃奎元
    Published 2012
    ..., this paper aims to improve the fatigue life of the package and ensure the stability of product quality. First...
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  10. 10
    by Tsung-Yueh Tsai, 蔡宗岳
    Published 2008
    ... products and the interconnection between the electronic components and printing circuit board due...
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  11. 11
    by Wen-Chi Liao, 廖文基
    Published 2008
    ...碩士 === 國立成功大學 === 工程科學系碩博士班 === 96 === In recent years, the consuming electronic products have been...
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  12. 12
    by Jin-Tiao Liang, 梁金條
    Published 2005
    ...碩士 === 國立成功大學 === 工程科學系碩博士班 === 93 ===  The Wafer Level Chip Scale Package (WLCSP) has increasingly...
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  13. 13
    by Ping-FengYang, 楊秉豐
    Published 2010
    ... product, such as IC design, manufacture, package assembly, test etc. The materials applied...
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