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1“... weight and high density of electronic products, the traditional single chip package has no longer met...”
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2“... packages, the most significant factors are chosen by the fractional factorial design method...”
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3“... life over the original design, far improving the reliability of QFN module package. ...”
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4“... to increase the fatigue life of the package by 86.5% compared to that of the original design ...”
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5“... of semiconductors for the electronic products, the electronic packaging has been focused on the technology of multi...”
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6“... density and the fatigue life of the package, the single-factor design analysis on the Direct Chip Attach...”
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7“... performance, low cost and multi-functions in electronics industries, the Package-on-package (PoP) stacking...”
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8“...碩士 === 國立成功大學 === 工程科學系碩博士班 === 101 === In recent years, the electronic products have been well...”
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9“..., this paper aims to improve the fatigue life of the package and ensure the stability of product quality. First...”
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10“... products and the interconnection between the electronic components and printing circuit board due...”
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11“...碩士 === 國立成功大學 === 工程科學系碩博士班 === 96 === In recent years, the consuming electronic products have been...”
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12“...碩士 === 國立成功大學 === 工程科學系碩博士班 === 93 === The Wafer Level Chip Scale Package (WLCSP) has increasingly...”
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13“... product, such as IC design, manufacture, package assembly, test etc. The materials applied...”
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